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Low contact resistivity between Ni/Au and p-GaN through thin heavily Mg-doped p-GaN and p-InGaN compound contact layer |
Li Xiao-Jing (李晓静), Zhao De-Gang (赵德刚), Jiang De-Sheng (江德生), Chen Ping (陈平), Zhu Jian-Jun (朱建军), Liu Zong-Shun (刘宗顺), Le Ling-Cong (乐伶聪), Yang Jing (杨静), He Xiao-Guang (何晓光) |
State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China |
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Abstract Thin heavily Mg-doped InGaN and GaN compound contact layer is used to form Ni/Au Ohmic contact to p-GaN. The growth conditions of the compound contact layer and its effect on the performance of Ni/Au Ohmic contact to p-GaN are investigated. It is confirmed that the specific contact resistivity can be lowered nearly two orders by optimizing the growth conditions of compound contact layer. When the flow rate ratio between Mg and Ga gas sources of p++-InGaN layer is 10.6% and the thickness of p++-InGaN layer is 3 nm, the lowest specific contact resistivity of 3.98×10-5Ω·cm2 is achieved. In addition, the experimental results indicate that the specific contact resistivity can be further lowered to 1.07×10-7Ω ·cm2 by optimizing the alloying annealing temperature to 520 ℃.
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Received: 20 April 2015
Revised: 19 August 2015
Accepted manuscript online:
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PACS:
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68.35.Ja
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(Surface and interface dynamics and vibrations)
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61.72.uj
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(III-V and II-VI semiconductors)
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61.82.Bg
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(Metals and alloys)
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67.25.bh
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(Films and restricted geometries)
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Fund: Project support by the National Natural Science Foundation of China (Grant Nos. 61474110, 61377020, 61376089, 61223005, and 61176126) and the National Science Fund for Distinguished Young Scholars, China (Grant No. 60925017). |
Corresponding Authors:
Zhao De-Gang
E-mail: dgzhao@red.semi.ac.cn
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Cite this article:
Li Xiao-Jing (李晓静), Zhao De-Gang (赵德刚), Jiang De-Sheng (江德生), Chen Ping (陈平), Zhu Jian-Jun (朱建军), Liu Zong-Shun (刘宗顺), Le Ling-Cong (乐伶聪), Yang Jing (杨静), He Xiao-Guang (何晓光) Low contact resistivity between Ni/Au and p-GaN through thin heavily Mg-doped p-GaN and p-InGaN compound contact layer 2015 Chin. Phys. B 24 116803
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