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Chin. Phys. B, 2023, Vol. 32(7): 076103    DOI: 10.1088/1674-1056/acc78f
Special Issue: SPECIAL TOPIC — Smart design of materials and design of smart materials
SPECIAL TOPIC—Smart design of materials and design of smart materials Prev   Next  

Enhanced mechanical and thermal properties of two-dimensional SiC and GeC with temperature and size dependence

Lei Huang(黄磊)1, Kai Ren(任凯)1,†, Huanping Zhang(张焕萍)1, and Huasong Qin(覃华松)2,‡
1 School of Mechanical and Electronic Engineering, Nanjing Forestry University, Nanjing 210037, China;
2 Laboratory for Multiscale Mechanics and Medical Science, SV LAB, School of Aerospace, Xi'an Jiaotong University, Xi'an 710049, China
Abstract  Two-dimensional materials with novel mechanical and thermal properties are available for sensors, photodetectors, thermoelectric, crystal diode and flexible nanodevices. In this investigation, the mechanical and thermal properties of pristine SiC and GeC are explored by molecular dynamics simulations. First, the fracture strength and fracture strain behaviors are addressed in the zigzag and armchair directions at 300 K. The excellent toughness of SiC and GeC is demonstrated by the maximal fracture strain of 0.43 and 0.47 in the zigzag direction, respectively. The temperature-tunable tensile strength of SiC and GeC is also investigated. Then, using non-equilibrium molecular dynamics (NEMD) calculations, the thermal performances of SiC and GeC are explored. In particular, the thermal conductivity of SiC and GeC shows a pronounced size dependence and reaches up to 85.67 W·m-1·K-1 and 34.37 W·m-1·K-1, respectively. The goal of our work is to provide a theoretical framework that can be used in the near future. This will enable us to design an efficient thermal management scheme for two-dimensional materials in electronics and optoelectronics.
Keywords:  two-dimensional      molecular dynamics      mechanical property      heat transport  
Received:  04 January 2023      Revised:  23 March 2023      Accepted manuscript online:  25 March 2023
PACS:  61.46.-w (Structure of nanoscale materials)  
Fund: All the authors would like to thank the support of the Natural Science Foundation of Jiangsu (Grant No. BK20220407), the National Natural Science Foundation of China (Grant Nos. 12102323, 11890674), the China Postdoctoral Science Foundation (Grant No. 2021M692574), and the Fundamental Research Funds for the Central Universities (Grant No. sxzy012022024). This work is also supported by the HPC Center, Nanjing Forestry University, China.
Corresponding Authors:  Kai Ren, Huasong Qin     E-mail:  kairen@njfu.edu.cn;huasongqin@xjtu.edu.cn

Cite this article: 

Lei Huang(黄磊), Kai Ren(任凯), Huanping Zhang(张焕萍), and Huasong Qin(覃华松) Enhanced mechanical and thermal properties of two-dimensional SiC and GeC with temperature and size dependence 2023 Chin. Phys. B 32 076103

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