Reduction of interfacial thermal resistance of overlapped graphene by bonding carbon chains

doi:10.1088/1674-1056/abc677

Abstract Exploring the mechanism of interfacial thermal transport and reducing the interfacial thermal resistance are of great importance for thermal management and modulation. Herein, the interfacial thermal resistance between overlapped graphene nanoribbons is largely reduced by adding bonded carbon chains as shown by molecular dynamics simulations. And the analytical model (phonon weak couplings model, PWCM) is utilized to analyze and explain the two-dimensional thermal transport mechanism at the cross-interface. An order of magnitude reduction of the interfacial thermal resistance is found as the graphene nanoribbons are bonded by just one carbon chain. Interestingly, the decreasing rate of the interfacial thermal resistance slows down gradually with the increasing number of carbon chains, which can be explained by the proposed theoretical relationship based on analytical model. Moreover, by the comparison of PWCM and the traditional simplified model, the accuracy of PWCM is demonstrated in the overlapped graphene nanoribbons. This work provides a new way to improve the interfacial thermal transport and reveal the essential mechanism for low-dimensional materials applied in thermal management.

Keywords: phonon engineering graphene phonon weak couplings model molecular dynamics

Received: 20 September 2020
Revised: 29 October 2020
Accepted manuscript online: 31 October 2020

PACS:	63.22.Rc	(Phonons in graphene)
	65.80.Ck	(Thermal properties of graphene)
	05.70.Np	(Interface and surface thermodynamics)
	31.15.xv	(Molecular dynamics and other numerical methods)

Fund: Project supported by the National Natural Science Foundation of China (Grant No. 51606072) and the Fundamental Research Funds for the Central Universities, HUST, China (Grant No. 2019kfyRCPY045).

Corresponding Authors: ^†Corresponding author. E-mail: dengcc@hust.edu.cn ^‡Corresponding author. E-mail: nuo@hust.edu.cn

Cite this article:

Yuwen Huang(黄钰文), Wentao Feng(冯文韬), Xiaoxiang Yu(余晓翔), Chengcheng Deng(邓程程), and Nuo Yang(杨诺) Reduction of interfacial thermal resistance of overlapped graphene by bonding carbon chains 2020 Chin. Phys. B 29 126303

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