Performance analysis of GaN-based high-electron-mobility transistors with postpassivation plasma treatment

doi:10.1088/1674-1056/abb7f6

Abstract AlGaN/GaN high-electron-mobility transistors (HEMTs) with postpassivation plasma treatment are demonstrated and investigated for the first time. The results show that postpassivation plasma treatment can reduce the gate leakage and enhance the drain current. Comparing with the conventional devices, the gate leakage of AlGaN/GaN HEMTs with postpassivation plasma decreases greatly while the drain current increases. Capacitance-voltage measurement and frequency-dependent conductance method are used to study the surface and interface traps. The mechanism analysis indicates that the surface traps in the access region can be reduced by postpassivation plasma treatment and thus suppress the effect of virtual gate, which can explain the improvement of DC characteristics of devices. Moreover, the density and time constant of interface traps under the gate are extracted and analyzed.

Keywords: GaN HEMT gate leakage trapping effect

Received: 16 July 2020
Revised: 28 August 2020
Accepted manuscript online: 14 September 2020

PACS:	85.30.Tv	(Field effect devices)
	85.30.De	(Semiconductor-device characterization, design, and modeling)
	73.61.Ey	(III-V semiconductors)
	73.50.Gr	(Charge carriers: generation, recombination, lifetime, trapping, mean free paths)

Fund: Project supported by the National Natural Science Foundation of China (Grant Nos. 61674130 and 61804139).

Corresponding Authors: ^†Corresponding author. E-mail: yuanjielv@163.com ^‡Corresponding author. E-mail: ga917vv@163.com ^§Corresponding author. E-mail: ececai@126.com

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Xing-Ye Zhou(周幸叶), Xin Tan(谭鑫), Yuan-Jie Lv(吕元杰), Guo-Dong Gu(顾国栋), Zhi-Rong Zhang(张志荣), Yan-Min Guo(郭艳敏), Zhi-Hong Feng(冯志红), and Shu-Jun Cai(蔡树军) Performance analysis of GaN-based high-electron-mobility transistors with postpassivation plasma treatment 2021 Chin. Phys. B 30 028502

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Performance analysis of GaN-based high-electron-mobility transistors with postpassivation plasma treatment

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