Investigation on quenching at a high-angle Cu grain boundary on an atomic scale
Zhang Lin (张林)a, Wang Shao-Qing (王绍青)b, Ye Heng-Qiang (叶恒强)b
a College of Science, Northeastern University, Shenyang 110004, China; b Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Abstract We have performed molecular dynamics simulations of structural changes due to quenching the melting interface at a Cu $\Sigma $5(310)/[001] symmetrical tilt grain boundary. The simulation results suggest that the grain boundary structures due to quenching are different from those due to heating up to the same temperature. The calculated atom density profiles show that the grain boundary structures can be significantly changed as they are quenched to quite low temperatures.
Received: 16 June 2005
Revised: 21 September 2005
Accepted manuscript online:
Fund: Project supported by the Special Foundation for State Major Basic Research Program of China (Grant No G2000067104)
Cite this article:
Zhang Lin (张林), Wang Shao-Qing (王绍青), Ye Heng-Qiang (叶恒强) Investigation on quenching at a high-angle Cu grain boundary on an atomic scale 2006 Chinese Physics 15 610
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