Abstract The process of graphene cleaning of a copper film by bombarding it with Ar13 clusters is investigated by the molecular dynamics method. The kinetic energies of the clusters are 5, 10, 20, and 30 eV and the incident angles are θ = 90°, 75°, 60°, 45°, and 0°. It is obtained that the cluster energy should be in the interval 20 eV-30 eV for effective graphene cleaning. There is no cleaning effect at vertical incidence (θ = 0°) of Ar13 clusters. The bombardments at 45° and 90° incident angles are the most effective on a moderate and large amount of deposited copper, respectively.
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