1 Institute of Technology and Science, Tokushima University, Tokushima 770-8506, Japan;
2 School of Electronics and Information Technology, Sun Yat-Sen University, Guangzhou 510275, China;
3 School of Microelectronics, Xidian University, Xi'an 710071, China
In this paper, we adopted thermally stable HfOxNy as gate dielectric for TiN/HfOxNy/AlGaN/GaN heterostructure field-effect transistors (HFETs) application. It demonstrated that the surface morphologies, composition, and optical properties of the HfOxNy films were dependent on oxygen flow rate in the O2/N2/Ar mixture sputtering ambient. The obtained metal-oxide-semiconductor heterostructure field-effect transistors by depositing HfO2 and HfOxNy dielectric at different oxygen flow rates possessed a small hysteresis and a low leakage current. After post deposition annealing at 900 ℃, the device using HfOxNy dielectric operated normally with good pinch-off characteristics, while obvious degradation are observed for the HfO2 gated one at 600 ℃. This result shows that the HfOxNy dielectric is a promising candidate for the self-aligned gate process.
Characteristics of urea under high pressure and high temperature Shuai Fang(房帅), Hong-An Ma(马红安), Long-Suo Guo(郭龙锁), Liang-Chao Chen(陈良超), Yao Wang(王遥), Lu-Yao Ding(丁路遥), Zheng-Hao Cai(蔡正浩), Jian Wang(王健), Xiao-Peng Jia(贾晓鹏). Chin. Phys. B, 2019, 28(9): 098101.
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