CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES |
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Ohmic contacts of 4H-SiC on ion-implantation layers |
Wang Shou-Guo(王守国)a)c)†, Zhang Yan(张岩)a), Zhang Yi-Men(张义门)b), and Zhang Yu-Ming(张玉明) b) |
a Department of Electronic and Information Engineering, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055, China; b School of Microelectronics, Xidian University, Xi'an 710071, China;; c School of Information Science and Technology, Northwest University, Xi'an 710127, China |
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Abstract The ohmic contacts of 4H-SiC are fabricated on nitrogen ion implanted layers made by performing box-like-profile implantation three and four times. Implantation parameters such as the standard deviation σ and the projection range Rp are calculated by the Monte Carlo simulator TRIM. Ni/Cr ohmic contacts on Si-face 4H-SiC implantation layers are measured by transfer length methods (TLMs). The results show that the values of sheet resistance Rsh are 30 kΩ /□ and 4.9 kΩ/□ and the values of specific contact resistance $\rho_{\rm c}$ of ohmic contacts are 7.1× 10-4 Ω$\cdot$cm2 and 9.5 × 10-5Ω $\cdot$ cm2 for the implanted layers with implantation performed three and four times respectively.
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Received: 03 April 2009
Revised: 18 May 2009
Accepted manuscript online:
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PACS:
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73.40.Ns
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(Metal-nonmetal contacts)
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68.55.Ln
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(Defects and impurities: doping, implantation, distribution, concentration, etc.)
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73.40.Cg
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(Contact resistance, contact potential)
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73.61.Le
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(Other inorganic semiconductors)
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Cite this article:
Wang Shou-Guo(王守国), Zhang Yan(张岩), Zhang Yi-Men(张义门), and Zhang Yu-Ming(张玉明) Ohmic contacts of 4H-SiC on ion-implantation layers 2010 Chin. Phys. B 19 017204
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