Thermal effect on endurance performance of 3-dimensional RRAM crossbar array

doi:10.1088/1674-1056/25/5/056501

Abstract

Three-dimensional (3D) crossbar array architecture is one of the leading candidates for future ultra-high density nonvolatile memory applications. To realize the technological potential, understanding the reliability mechanisms of the 3D RRAM array has become a field of intense research. In this work, the endurance performance of the 3D 1D1R crossbar array under the thermal effect is investigated in terms of numerical simulation. It is revealed that the endurance performance of the 3D 1D1R array would be seriously deteriorated under thermal effects as the feature size scales down to a relatively small value. A possible method to alleviate the thermal effects is provided and verified by numerical simulation.

Keywords: 3-dimensional resistive random access memory (RRAM) thermal effect endurance performance

Received: 23 December 2015
Revised: 22 February 2016
Accepted manuscript online:

PACS:	65.60.+a	(Thermal properties of amorphous solids and glasses: heat capacity, thermal expansion, etc.)
	66.30.Xj	(Thermal diffusivity)
	68.35.bg	(Semiconductors)

Fund:

Project supported by the Opening Project of Key Laboratory of Microelectronics Devices & Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences, the National High Technology Research and Development Program of China (Grant No. 2014AA032901), the National Natural Science Foundation of China (Grant Nos. 61574166, 61334007, 61306117, 61322408, 61221004, and 61274091), Beijing Training Project for the Leading Talents in S&T, China (Grant No. Z151100000315008), and the CAEP Microsystem and THz Science and Technology Foundation, China (Grant No. CAEPMT201504).

Corresponding Authors: Ling Li
E-mail: lingli@ime.ac.cn

Cite this article:

Nianduan Lu(卢年端), Pengxiao Sun(孙鹏霄), Ling Li(李泠), Qi Liu(刘琦), Shibing Long(龙世兵), Hangbing Lv(吕杭炳), Ming Liu(刘明) Thermal effect on endurance performance of 3-dimensional RRAM crossbar array 2016 Chin. Phys. B 25 056501

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Thermal effect on endurance performance of 3-dimensional RRAM crossbar array

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