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Low-loss, high-coherence airbridge interconnects fabricated by single-step lithography |
| Ji-Bang Fu(付济邦), Bo Ren(任波), Jian-Dong Ouyang(欧阳剑东), Cong Li(李璁), Ke-Cheng-Qi Zhu(朱可承琪), Yong-Gang Che(车永刚), Xiang Fu(付祥), Shi-Chuan Xue(薛诗川), Zhao-Hua Yang(杨钊华)†, Ming-Tang Deng(邓明堂)‡, and Jun-Jie Wu(吴俊杰) |
| College of Computer Science and Technology, National University of Defense Technology, Changsha 410073, China |
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Abstract Airbridges are essential for creating high-performance, low-parasitic interconnects in integrated circuits and quantum devices. Conventional multi-step fabrication methods hinder miniaturization and introduce process-related defects. We report a simplified process that enables the fabrication of nanoscale airbridges with just one step of electron-beam lithography. By optimizing a multilayer resist stack with a triple-exposure-dose scheme and a thermal reflow step, we achieve burr-free, suspended metallic bridges with sub-micron features that exhibit robust mechanical stability. Fabricated within a gradiometric SQUID design for superconducting transmon qubits, these airbridges introduce no measurable additional loss in the relaxation time $T_1$, while enabling a 2.5-fold enhancement of the dephasing time $T_2^*$. This efficient method offers a practical route toward integrating high-performance three-dimensional interconnects in advanced quantum and nano-electronic devices.
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Received: 29 January 2026
Revised: 05 March 2026
Accepted manuscript online: 12 March 2026
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PACS:
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03.67.Lx
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(Quantum computation architectures and implementations)
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81.07.-b
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(Nanoscale materials and structures: fabrication and characterization)
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85.25.-j
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(Superconducting devices)
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85.25.Am
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(Superconducting device characterization, design, and modeling)
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| Fund: We thank Yang Yang, Xiao-Feng Yi, Ding-Dong Liu, Peng Luo, and Kang-Ding Zhao for technical support in device fabrication and measurements. Project supported by the National Key R&D Program of China (Grant No. 2024YFB4504000) and the Aid Program for Science and Technology Innovative Research Team in Higher Educational Institutions of Hunan Province. Device fabrication was partially performed at the Synergetic Extreme Condition User Facility (SECUF). |
Corresponding Authors:
Zhao-Hua Yang, Ming-Tang Deng
E-mail: zhaohuayang@quanta.org.cn;mtdeng@nudt.edu.cn
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Cite this article:
Ji-Bang Fu(付济邦), Bo Ren(任波), Jian-Dong Ouyang(欧阳剑东), Cong Li(李璁), Ke-Cheng-Qi Zhu(朱可承琪), Yong-Gang Che(车永刚), Xiang Fu(付祥), Shi-Chuan Xue(薛诗川), Zhao-Hua Yang(杨钊华), Ming-Tang Deng(邓明堂), and Jun-Jie Wu(吴俊杰) Low-loss, high-coherence airbridge interconnects fabricated by single-step lithography 2026 Chin. Phys. B 35 040312
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[1] Sherwin M E, Simmons J A, Eiles T E, Harff N E and Klem J F 1994 Appl. Phys. Lett. 65 2326 [2] Villeneuve P R, Fan S, Joannopoulos J D, Lim K, Petrich G S, Kolodziejski L A and Reif R 1995 Appl. Phys. Lett. 67 167 [3] Borzenko T, Gould C, Schmidt G and Molenkamp L 2004 Microelectron. Eng. 75 210 [4] Girgis E, Liu J and Benkhedar M L 2006 Appl. Phys. Lett. 88 202103 [5] Chen Z, Megrant A, Kelly J, Barends R, Bochmann J, Chen Y, Chiaro B, Dunsworth A, Jeffrey E, Mutus J Y, O'Malley P J J, Neill C, Roushan P, Sank D, Vainsencher A,Wenner J, White T C, Cleland A N and Martinis J M 2014 Appl. Phys. Lett. 104 052602 [6] Sun Y, Ding J, Xia X, Wang X, Xu J, Song S, Lan D, Zhao J and Yu Y 2022 Appl. Phys. Lett. 121 074001 [7] Stavenga T, Khan S A, Liu Y, Krogstrup P and DiCarlo L 2023 Appl. Phys. Lett. 123 024004 [8] Huang Y H,Wang H, Shen Z, Thomas A, Richardson C J K and Palmer B S 2025 Appl. Phys. Lett. 127 044002 [9] Bolgar A N, Kalacheva D A, Lubsanov V B, Dmitriev A Y, Alekseeva E S, Korostylev E V and Astafiev O V 2025 J. Appl. Phys. 137 154401 [10] Zhang Y, Liu J, Li Y and Yang F 2007 Mater. Sci. Semicond. Process. 10 194 [11] Dunsworth A, Barends R, Chen Y, Chen Z, Chiaro B, Fowler A, Foxen B, Jeffrey E, Kelly J, Klimov P V, Lucero E, Mutus J Y, Neeley M, Neill C, Quintana C, Roushan P, Sank D, Vainsencher A, Wenner J, White T C, Neven H, Martinis J M and Megrant A 2018 Appl. Phys. Lett. 112 063502 [12] Tao H R, Zhang C, Du L, Yang X X, Guo L L, Chen Y, Zhang H F, Jia Z L, Kong W C, Duan P and Guo G P 2024 Appl. Phys. Lett. 125 034001 [13] Bu K, Huai S, Zhang Z, Li D, Li Y, Hu J, Yang X, Dai M, Cai T, Zheng Y C, et al. 2025 npj Quantum Inf. 11 17 [14] Bruckmoser N, Koch L, Tsitsilin I, Grammer M, Bunch D, Richard L, Schirk J, Wallner F, Feigl J, Schneider C M F, Geprägs S, Bader V P, Althammer M, Södergren L and Filipp S 2026 Phys. Rev. Appl. 25 024007 [15] Siddiqi I 2021 Nat. Rev. Mater. 6 875 [16] Mahuli N, Minguzzi J, Gao J, Resnick R, Diez S, Cosmic R, Marcaud G, Hunt M, Swenson L, Rose J, Painter O and Jarrige I 2025 ACS Nano 19 41136 [17] Janzen N, Kononenko M, Ren S and Lupascu A 2022 Appl. Phys. Lett. 121 094001 [18] Jin Y, Moreno M, T Vianez P M, TanWK, Griffiths J P, Farrer I, Ritchie D A and Ford C J B 2021 Appl. Phys. Lett. 118 162108 [19] Fu J B, Wang D W, Ren B, Yang Z H, Hu S, Huang G Y, Cao S H, Liu D D, Zhang X F, Fu X, Xue S C, Che Y G, Liu Y, Deng M T and Wu J J 2026 arXiv:2601.02137 [quant-ph] [20] Wu Y, BaoWS, Cao S, Chen F, Chen M C, Chen X, Chung T H, Deng H, Du Y, Fan D, Gong M, et al. 2021 Phys. Rev. Lett. 127 180501 [21] Shi Y H, Liu Y, Zhang Y R, Xiang Z, Huang K, Liu T, Wang Y Y, Zhang J C, Deng C L, Liang G H, Mei Z Y, Li H, Li T M, Ma W G, Liu H T, Chen C T, Liu T, Tian Y, Song X, Zhao S P, Xu K, Zheng D, Nori F and Fan H 2023 Phys. Rev. Lett. 131 080401 [22] Xiang Z C, Huang K, Zhang Y R, Liu T, Shi Y H, Deng C L, Liu T, Li H, Liang G H, Mei Z Y, et al. 2023 Nat. Commun. 14 5433 [23] Wu Z H, Lei L X, Zhang X F, Xue S C, Hu S, Li C, Fu X, Chen P X, Lu K, Deng M T and Wu J J 2025 Chin. Phys. Lett. 42 040501 |
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