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Chinese Physics, 2004, Vol. 13(8): 1365-1369    DOI: 10.1088/1009-1963/13/8/033
CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES Prev   Next  

Structural evolution of a-Si:H/SiO2 multilayers upon step by step thermal annealing

Mei Jia-Xin (梅嘉欣)a, Xu Jun (徐骏)ab, Ma Zhong-Yuan (马忠元)a, Zhu-Da (朱达)a, Sui Yan-Ping (隋妍萍)a, Li Wei (李伟)a, Li Xin (李鑫)a, Rui Yun-Jun (芮云军)a, Huang Xin-Fan (黄信凡)a, Chen Kun-Ji (陈坤基)a
a National Laboratory of Solid State Microstructures and Department of Physics, Nanjing University, Nanjing 210093, China; National Laboratory for Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
Abstract  a-Si:H/SiO_2 multilayers were prepared by alternatively changing plasma enhanced chemical vapour deposition of a-Si:H layers and in situ plasma oxidation process. Subsequently, as-grown samples were annealed at temperatures from 350℃ to 1100℃ in N$_2$ ambient with an increment of 100℃. The evolution of bonding configurations and structures with annealing treatments was systematically investigated by Fourier-transform infrared spectroscopy. The peak position of Si-O stretching vibration of SiO$_2$ layers shift to 1087cm$^{-1}$ after annealing at 1100℃, which demonstrates that the SiO$_2$ films fabricated by plasma oxidation after high temperature annealing can have similar properties to the thermal grown ones. A Si-O vibration from interfacial SiO$_x$ was identified: the value x was found to increase as increasing the annealing temperature, which is ascribed to the cooperation of hydrogen effusion and reordering of the oxygen bond in SiO$_x $networks. The H-related bonds were observed in the form of H-Si-O$_3$ and H-Si-Si$_{3-n}$O$_n$ (n=1-2) configurations, which are supposed to be present in SiO$_2$ and interfacial SiO$_x$ layers, respectively. The H atoms bonded in different bonding configurations effuse at different temperatures due to their different desorption energies.
Keywords:  a-Si:H/SiO$_2$ multilayers      annealing      bonding configurations  
Received:  17 October 2003      Revised:  12 February 2004      Accepted manuscript online: 
PACS:  68.65.Ac (Multilayers)  
  81.40.Gh (Other heat and thermomechanical treatments)  
  61.72.Cc (Kinetics of defect formation and annealing)  
  78.30.Er (Solid metals and alloys ?)  
  52.77.Dq (Plasma-based ion implantation and deposition)  
  81.15.Gh (Chemical vapor deposition (including plasma-enhanced CVD, MOCVD, ALD, etc.))  
  78.30.-j (Infrared and Raman spectra)  
  82.30.-b (Specific chemical reactions; reaction mechanisms)  
Fund: Project supported by the National Natural Science Foundation of China (Grant Nos 10374049, 10174035, 90301009), the State Key Programme for Basic Research of China (Grant No 2001CB610503) and the Natural Science Foundation of Jiangsu Province (Grant No BK

Cite this article: 

Mei Jia-Xin (梅嘉欣), Xu Jun (徐骏), Ma Zhong-Yuan (马忠元), Zhu-Da (朱达), Sui Yan-Ping (隋妍萍), Li Wei (李伟), Li Xin (李鑫), Rui Yun-Jun (芮云军), Huang Xin-Fan (黄信凡), Chen Kun-Ji (陈坤基) Structural evolution of a-Si:H/SiO2 multilayers upon step by step thermal annealing 2004 Chinese Physics 13 1365

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