CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES |
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Closed-form internal impedance model and characterization of mixed carbon nanotube bundles for three-dimensional integrated circuits |
Qijun Lu(卢启军), Zhangming Zhu(朱樟明), Yintang Yang(杨银堂), Ruixue Ding(丁瑞雪), Yuejin Li(李跃进) |
School of Microelectronics, Xidian University, Xi'an 710071, China |
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Abstract Based on the complex effective conductivity method, a closed-form expression for the internal impedance of mixed carbon nanotube (CNT) bundles, in which the number of CNTs for a given diameter follows a Gaussian distribution, is proposed in this paper. It can appropriately capture the skin effect as well as the temperature effect of mixed CNT bundles. The results of the closed-form expression and the numerical calculation are compared with various mean diameters, standard deviations, and temperatures. It is shown that the proposed model has very high accuracy in the whole frequency range considered, with maximum errors of 1% and 2.3% for the resistance and the internal inductance, respectively. Moreover, by using the proposed model, the high-frequency electrical characteristics of mixed CNT bundles are deeply analyzed to provide helpful design guidelines for their application in future high-performance three-dimensional integrated circuits.
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Received: 06 August 2017
Revised: 03 October 2017
Accepted manuscript online:
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PACS:
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73.63.-b
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(Electronic transport in nanoscale materials and structures)
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81.07.De
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(Nanotubes)
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85.35.Kt
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(Nanotube devices)
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Fund: Project supported by the National Science and Technology Major Project of China (Grant No. 2015ZX03001004) and the National Natural Science Foundation of China (Grant Nos. 61604113, 61625403, 61334003, 61376039, 61574104, and 61474088). |
Corresponding Authors:
Qijun Lu
E-mail: luqijun2000@126.com,qjlu@xidian.edu.cn
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Cite this article:
Qijun Lu(卢启军), Zhangming Zhu(朱樟明), Yintang Yang(杨银堂), Ruixue Ding(丁瑞雪), Yuejin Li(李跃进) Closed-form internal impedance model and characterization of mixed carbon nanotube bundles for three-dimensional integrated circuits 2018 Chin. Phys. B 27 017303
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