The effect of deposition temperature on the intermixing and microstructure of Fe/Ni thin film

doi:10.1088/1674-1056/19/12/126801

Abstract The physical vapour deposition of Ni atoms on $\alpha$-Fe(001) surface under different deposition temperatures were simulated by molecular dynamics to study the intermixing and microstructure of the interfacial region. The results indicate that Ni atoms hardly penetrate into Fe substrate while Fe atoms easily diffuse into Ni deposition layers. The thickness of the intermixing region is temperature-dependent, with high temperatures yielding larger thicknesses. The deposited layers are mainly composed of amorphous phase due to the abnormal deposition behaviour of Ni and Fe. In the deposited Ni-rich phase, the relatively stable metallic compound B₂ structured FeNi is found under high deposition temperature conditions.

Keywords: molecular dynamics physical vapour deposition Ni/Fe thin film temperature effect

Received: 16 December 2009
Revised: 16 March 2010
Accepted manuscript online:

PACS:	68.55.-a	(Thin film structure and morphology)
	81.15.Aa	(Theory and models of film growth)

Fund: Project supported by the National Natural Science Foundation for Young Scientists of China (Grant No. 10702058) and the China Postdoctoral Science Foundation (Grant No. 20090451100).

Cite this article:

Chen Shang-Da(陈尚达), Wang Tao(王涛), Zheng De-Li(郑德立), and Zhou Yi-Chun(周益春) The effect of deposition temperature on the intermixing and microstructure of Fe/Ni thin film 2010 Chin. Phys. B 19 126801

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The effect of deposition temperature on the intermixing and microstructure of Fe/Ni thin film

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