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Chin. Phys. B, 2016, Vol. 25(5): 057306    DOI: 10.1088/1674-1056/25/5/057306
CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES Prev   Next  

Contact resistance asymmetry of amorphous indium-gallium-zinc-oxide thin-film transistors by scanning Kelvin probe microscopy

Chen-Fei Wu(武辰飞)1,2, Yun-Feng Chen(陈允峰)1,2, Hai Lu(陆海)1,2, Xiao-Ming Huang(黄晓明)3, Fang-Fang Ren(任芳芳)1,2, Dun-Jun Chen(陈敦军)1,2, Rong Zhang(张荣)1,2, You-Dou Zheng(郑有炓)1,2
1. Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials, and School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China;
2. Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China;
3. Peter Grünberg Research Center, Nanjing University of Posts and Telecommunications, Nanjing 210003, China
Abstract  

In this work, a method based on scanning Kelvin probe microscopy is proposed to separately extract source/drain (S/D) series resistance in operating amorphous indium-gallium-zinc-oxide (a-IGZO) thin-film transistors. The asymmetry behavior of S/D contact resistance is deduced and the underlying physics is discussed. The present results suggest that the asymmetry of S/D contact resistance is caused by the difference in bias conditions of the Schottky-like junction at the contact interface induced by the parasitic reaction between contact metal and a-IGZO. The overall contact resistance should be determined by both the bulk channel resistance of the contact region and the interface properties of the metal-semiconductor junction.

Keywords:  amorphous indium-gallium-zinc-oxide thin-film transistors      contact resistance      surface potential  
Received:  04 November 2015      Revised:  05 January 2016      Accepted manuscript online: 
PACS:  73.61.Jc (Amorphous semiconductors; glasses)  
  73.40.Qv (Metal-insulator-semiconductor structures (including semiconductor-to-insulator))  
  73.30.+y (Surface double layers, Schottky barriers, and work functions)  
  73.40.Cg (Contact resistance, contact potential)  
Fund: 

Project supported by the Key Industrial R&D Program of Jiangsu Province, China (Grant No. BE2015155), the Priority Academic Program Development of Higher Education Institutions of Jiangsu Province, China, and the Fundamental Research Funds for the Central Universities, China (Grant No. 021014380033).

Corresponding Authors:  Hai Lu     E-mail:  hailu@nju.edu.cn

Cite this article: 

Chen-Fei Wu(武辰飞), Yun-Feng Chen(陈允峰), Hai Lu(陆海), Xiao-Ming Huang(黄晓明), Fang-Fang Ren(任芳芳), Dun-Jun Chen(陈敦军), Rong Zhang(张荣), You-Dou Zheng(郑有炓) Contact resistance asymmetry of amorphous indium-gallium-zinc-oxide thin-film transistors by scanning Kelvin probe microscopy 2016 Chin. Phys. B 25 057306

[1] Lin C L, Chang W Y and Hung C C 2013 IEEE Electron Device Lett. 34 1166
[2] Nomura K, Takagi A, Kamiya T, Ohta H, Hirano M and Hosono H 2006 Jpn. J. Appl. Phys. 45 4303
[3] Ning H L, Hu S B, Zhu F, Yao R H, Xu M, Zou J H, Tao H, Xu R X, Xu H, Wang L, Lan L F and Peng J B 2015 Acta Phys. Sin. 64 126103 (in Chinese)
[4] Yu G, Wu C F, Lu H, Ren F F, Zhang R, Zheng Y D and Huang X M 2015 Chin. Phys. Lett. 32 047302
[5] Jun S, Bae H, Kim H, Lee J, Choi S J, Kim D H and Kim D M 2015 IEEE Electron Device Lett. 36 144
[6] Bae H, Kim S, Bae M, Shin J S, Kong D, Jung H, Jang J, Lee J, Kim D H and Kim D M 2011 IEEE Electron Device Lett. 32 761
[7] Vatel O and Tanimoto M 1995 J. Appl. Phys. 77 2358
[8] Melitz W, Shen J, Kummel A C and Lee S 2011 Surf. Sci. Rep. 66 1
[9] Bürgi L, Sirringhaus H and Friend R 2002 Appl. Phys. Lett. 80 2913
[10] Li T, Ruden P, Campbell I and Smith D 2003 J. Appl. Phys. 93 4017
[11] Ikeda S, Shimada T, Kiguchi M and Saiki K 2007 J. Appl. Phys. 101 094509
[12] Rha S H, Kim U K, Jung J, Kim H K, Jung Y S, Hwang E S, Chung Y J, Lee M, Choi J H and Hwang C S 2013 IEEE Trans. Electron Devices 60 1128
[13] Bürgi L, Richards T J, Friend R H and Sirringhaus H 2003 J. Appl. Phys. 94 6129
[14] Puntambekar K P, Pesavento P V and Frisbie C D 2003 Appl. Phys. Lett. 83 5539
[15] Park J, Kim C, Kim S, Song I, Kim S, Kang D, Lim H, Yin H, Jung R, Lee E, Lee J, Kwon K W and Park Y 2008 IEEE Electron Device Lett. 29 879
[16] Shimura Y, Nomura K, Yanagi H, Kamiya T, Hirano M and Hosono H 2008 Thin Solid Films 516 5899
[17] Barquinha P, Martins R, Pereira L and Fortunato E 2012 Transparent Oxide Electronics: From Materials to Devices (Chichester: John Wiley and Sons) p. 183
[18] Choi K H and Kim H K 2013 Appl. Phys. Lett. 102 052103
[19] Fung T C, Chuang C S, Chen C, Abe K, Cottle R, Townsend M, Kumomi H and Kanicki J 2009 J. Appl. Phys. 106 84511
[20] Lee J K, Lee J W, Park J, Chung S W, Roh J S, Hong S J, Cho I W, Kwon H I and Lee J H 2011 Appl. Phys. Lett. 98 143502
[21] Kim S, Jeong H Y, Choi S Y and Choi Y K 2010 Appl. Phys. Lett. 97 033508
[22] Trost S, Becker T, Zilberberg K, Behrendt A, Polywka A, Heiderhoff R, Görrn P and Riedl T 2015 Sci. Rep. 2015 5
[23] Sze S M and Ng K K 2006 Physics Semiconductor Devices (Chichester: John Wiley and Sons) p. 137
[24] Chung H J, Jeong J H, Ahn T K, Lee H J, Kim M, Jun K, Park J S, Jeong J K, Mo Y G and Kim H D 2008 Electrochem. Solid-State Lett. 11 H51
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