Please wait a minute...
Chin. Phys. B, 2026, Vol. 35(5): 057108    DOI: 10.1088/1674-1056/ae3c94
RAPID COMMUNICATION Prev   Next  

Design and optimization of area-selective carrier modulation in β-Ga2O3 through high temperature oxygen annealing

Qiuyan Li(李秋艳)1, Qiming He(何启鸣)2, Jinyang Liu(刘金杨)1, Xuanze Zhou(周选择)1, Guangwei Xu(徐光伟)1,†, and Shibing Long(龙世兵)1
1 School of Microelectronics, University of Science and Technology of China, Hefei 230026, China;
2 School of Electronic Information Engineering, Beihang University, Beijing 100191, China
Abstract  Carrier modulation in beta-gallium oxide ($\beta $-Ga$_{2}$O$_{3}$) films through an oxygen annealing method is systematically investigated, including annealing time and annealing cap layer (ACL) design. Capacitance-voltage measurement conducted on vertical SBD structures was used to evaluate the carrier concentration after annealing. The formation of a “surface layer” may suppress the diffusion of oxygen species as the annealing time increases. An 8-hour annealing time resulted in a carrier modulation with an approximately 3-μm-deep low-carrier-concentration layer. The annealing cap layer, consisting of poly-Si and SiO$_{2}$, was deposited and patterned to achieve area-selective carrier modulation in $\beta $-Ga$_{2}$O$_{3}$. The effective thickness of poly-Si for blocking oxygen diffusion was confirmed by scanning electron microscopy (SEM) for the first time. A definite thickness of SiO$_{2}$ served as both etching stop layer and lift-off layer for poly-Si. According to simulation results, the non-ideal surface caused extra high peak electric field in the $\beta $-Ga$_{2}$O$_{3}$ device. A combination of an optimized dry etching method and low-compressive-stress deposition technology was employed to eliminate the bird's beak-like shape structure that appeared at the edges of the patterns and bulges on the $\beta $-Ga$_{2}$O$_{3}$ surface after annealing. The feasibility of the carrier modulation technology enables the diversity of $\beta $-Ga$_{2}$O$_{3}$ devices fabrication.
Keywords:  Ga$_{2}$O$_{3}$      oxygen annealing      carrier modulation      power device  
Received:  17 December 2025      Revised:  13 January 2026      Accepted manuscript online:  23 January 2026
PACS:  71.55.-i (Impurity and defect levels)  
  73.61.-r (Electrical properties of specific thin films)  
  85.30.-z (Semiconductor devices)  
Fund: This work was supported by the National Natural Science Foundation of China (Grant Nos. 61925110, U23A20358, and 62234007), the University of Science and Technology of China (USTC) Research Funds of the Double First-Class Initiative (Grant Nos. YD2100002009 and YD2100002010), the Collaborative Innovation Program of Hefei Science Center, Chinese Academy of Sciences (CAS) (Grant No. 2022HSCCIP024), the JieBang Headed Project of Changsha City Hunan Province (Grant No. kq2301006), and the Opening Project of and the Key Laboratory of Nanodevices and Applications in Suzhou Institute of Nano-Tech and Nano-Bionics of CAS (Grant No. SZLAB-1208-2024-ZD012).
Corresponding Authors:  Guangwei Xu,E-mail:xugw@ustc.edu.cn     E-mail:  xugw@ustc.edu.cn

Cite this article: 

Qiuyan Li(李秋艳), Qiming He(何启鸣), Jinyang Liu(刘金杨), Xuanze Zhou(周选择), Guangwei Xu(徐光伟), and Shibing Long(龙世兵) Design and optimization of area-selective carrier modulation in β-Ga2O3 through high temperature oxygen annealing 2026 Chin. Phys. B 35 057108

[1] Pearton S J, Yang J, IV P H C, Ren F, Kim J, Tadjer M J and Mastro M A 2018 Appl. Phys. Rev. 5011301
[2] Green A J, Speck J, Xing G, et al. 2022 APL Mater. 10029201
[3] Lin C H, Yuda Y, Wong M H, Sato M, Takekawa N, Konishi K, Watahiki T, Yamamuka M, Murakami H, Kumagai Y and Higashiwaki M 2019 IEEE Electron Device Lett. 401487
[4] Zhou H, Yan Q, Zhang J, Lv Y, Liu Z, Zhang Y, Dang K, Dong P, Feng Z, Feng Q, Ning J, Zhang C, Ma P and Hao Y 2019 IEEE Electron Device Lett. 401788
[5] Zhang Y, Zhang J, Feng Z, Hu Z, Chen J, Dang K, Yan Q, Dong P, Zhou H and Hao Y 2020 IEEE Trans. Electron Devices 673948
[6] Wong M H, Murakami H, Kumagai Y and Higashiwaki M 2020 IEEE Electron Device Lett. 41296
[7] Wong M H, Lin C H, Kuramata A, Yamakoshi S, Murakami H, Kumagai Y and Higashiwaki M 2018 Appl. Phys. Lett. 113102103
[8] Ma Y, Zhou X, Tang W, Zhang X, Xu G, Zhang L, Chen T, Dai S, Bian C, Li B, Zeng Z and Long S 2023 IEEE Electron Device Lett. 44384
[9] Zhou X, Ma Y, Xu G, Liu Q, Liu J, He Q, Zhao X and Long S 2022 Appl. Phys. Lett. 121120502
[10] Wang Y, Lv Y, Long S, Zhou X, Song X, Liang S, Han T, Tan X, Feng Z, Cai S and Liu M 2020 IEEE Electron Device Lett. 41131
[11] Xia Z, Joishi C, Krishnamoorthy S, Bajaj S, Zhang Y, Brenner M, Lodha S and Rajan S 2018 IEEE Electron Device Lett. 39568
[12] Tetzner K, Thies A, Bahat Treidel E, Brunner F, Wagner G and Wurfl J 2018 Appl. Phys. Lett. 113102103
[13] Xu S Y, Zhang X M, Liu Z T, Wang H, Chen D Z and Guo G C 2024 Chin. Phys. B 33017302
[14] Lingaparthi R, Thieu Q T, Sasaki K, Takatsuka A, Otsuka F, Yamakoshi S and Kuramata A 2020 ECS J. Solid State Sci. Technol. 9024004
[15] Oshima T, Kaminaga K, Mukai A, Sasaki K, Masui T, Kuramata A, Yamakoshi S, Fujita S and Ohtomo A 2013 Jpn. J. Appl. Phys. 52051101
[16] Korhonen E, Tuomisto F, Gogova D, Wagner G, Baldini M, Galazka Z, Schewski R and Albrecht M 2015 Appl. Phys. Lett. 106242103
[17] Tadjer M J, Freitas J A, Culbertson J C, Weber M H, Glaser E R, Mock A L, Mahadik N A, Schmieder K, Jackson E, Gallagher J C, Feigelson B N and Kuramata A 2020 J. Phys. D: Appl. Phys. 53504002
[18] Jesenovec J, Weber M H, Pansegrau C, McCluskey M D, Lynn K G and McCloy J S 2021 J. Appl. Phys. 129225702
[19] Swain S K, Weber M H, Jesenovec J, Saleh M, Lynn K G and McCloy J S 2021 Phys. Rev. Appl. 15054010
[20] Higashiwaki M and Fujita S 2020 Gallium Oxide: Materials Properties, Crystal Growth, and Devices (Springer, Cham) p. 72–74
[21] He Q, Zhou X, Li Q, Hao W, Liu Q, Han Z, Zhou K, Chen C, Peng J, Xu G, Zhao X, Wu X and Long S 2022 IEEE Electron Device Lett. 431933
[22] Liao Z Y, Xu R, Li J S, Li C K, Wang H, Zhang M Z, Wang B and Liu H 2025 Chin. Phys. B 34017301
[23] He Q, Li Q, Zhou X, Liu Q, Hao W, Han Z, Xu G, Wu X and Long S 2023 Proceedings of the IEEE Electron Devices Technology & Manufacturing Conference, March 7–10, Seoul, South Korea, p. 1
[24] Sinha A K, Levinstein H J and Smith T E 1978 J. Appl. Phys. 492423
[25] Bassous E, Yu H N and Maniscalco V 1976 J. Electrochem. Soc. 1231729
[26] Wu T C, Stacy W T and Ritz K N 1983 J. Electrochem. Soc. 1301563
[27] Shankoff T A, Sheng T T, Haszko S E, Marcus R B and Smith T E 1980 J. Electrochem. Soc. 127216
[28] Stoney G G and Parsons C A 1909 Proc. R. Soc. Lond. A 82172
[1] Visible transparent β-Ga2O3 solar-blind UV high-performance photodetector for stable high-temperature operation
Chao Zhang(张超), Jinpeng Dong(董瑾鹏), Gang Li(李刚), Yida Guan(管艺达), Jiahao Zhang(张嘉豪), Qingyu Wang(王清玉), Zhilin Wang(王志林), Duo Sun(孙多), Yue Sun(孙悦), and Lili Wang(王丽丽). Chin. Phys. B, 2026, 35(5): 056106.
[2] Effects of different growth conditions on epitaxial growth of (001) Ga2O3 films by MOCVD
Ke Qin(秦柯), Yun-Long He(何云龙), Zhan Wang(王湛), Jing Sun(孙静), Ying Zhou(周颖), Yang Liu(刘洋), Jin-Wei Liu(刘金炜), Zhuo-Wen Huang(黄卓文), Ji-Wei Jiang(江继伟), Zhu Jin(金竹), Hui Zhang(张辉), Xiao-Li Lu(陆小力), Xue-Feng Zheng(郑雪峰), Xiao-Hua Ma(马晓华), and Yue Hao(郝跃). Chin. Phys. B, 2026, 35(4): 048201.
[3] Self-powered horizontally structured n-n heterojunction photodetector based on Si-GaN/β-Ga2O3 for UV detection
Muzi Li(李木子), Maolin Zhang(张茂林), Xueqiang Ji(季学强), Shan Li(李山), Lili Yang(杨莉莉), and Weihua Tang(唐为华). Chin. Phys. B, 2026, 35(2): 028502.
[4] Low leakage current β-Ga2O3 MOS capacitors with ALD deposited Al2O3 gate dielectric using ozone as precursor
Zheng-Yi Liao(廖正一), Pai-Wen Fang(方湃文), Xing Lu(卢星), Gang Wang(王钢), and Yan-Li Pei(裴艳丽). Chin. Phys. B, 2025, 34(6): 067304.
[5] Strain tunable excitonic optical properties in monolayer Ga2O3
Hao-Lei Cui(崔浩磊), Zhen Quan(权真), and Shu-Dong Wang(王舒东). Chin. Phys. B, 2024, 33(10): 107104.
[6] NiO/β-Ga2O3 heterojunction diodes with ultra-low leakage current below 10-10 A and high thermostability
Yi Huang(黄义), Wen Yang(杨稳), Qi Wang(王琦), Sheng Gao(高升), Wei-Zhong Chen(陈伟中), Xiao-Sheng Tang(唐孝生), Hong-Sheng Zhang(张红升), and Bin Liu(刘斌). Chin. Phys. B, 2023, 32(9): 098502.
[7] SiC gate-controlled bipolar field effect composite transistor with polysilicon region for improving on-state current
Baoxing Duan(段宝兴), Kaishun Luo(罗开顺), and Yintang Yang(杨银堂). Chin. Phys. B, 2023, 32(4): 047702.
[8] Design and fabrication of 10-kV silicon-carbide p-channel IGBTs with hexagonal cells and step space modulated junction termination extension
Zheng-Xin Wen(温正欣), Feng Zhang(张峰), Zhan-Wei Shen(申占伟), Jun Chen(陈俊), Ya-Wei He(何亚伟), Guo-Guo Yan(闫果果), Xing-Fang Liu(刘兴昉), Wan-Shun Zhao(赵万顺), Lei Wang(王雷), Guo-Sheng Sun(孙国胜), Yi-Ping Zeng(曾一平). Chin. Phys. B, 2019, 28(6): 068504.
[9] Effect of alumina thickness on Al2O3/InP interface with post deposition annealing in oxygen ambient
Yang Zhuo (杨卓), Yang Jing-Zhi (杨靖治), Huang Yong (黄永), Zhang Kai (张锴), Hao Yue (郝跃). Chin. Phys. B, 2014, 23(7): 077305.
[10] Trapezoid mesa trench metal–oxide semiconductor barrier Schottky rectifier: an improved Schottky rectifier with better reverse characteristics
Li Wei-Yi(李惟一), Ru Guo-Ping(茹国平), Jiang Yu-Long(蒋玉龙), and Ruan Gang(阮刚) . Chin. Phys. B, 2011, 20(8): 087304.
No Suggested Reading articles found!