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Chin. Phys. B, 2019, Vol. 28(6): 068504    DOI: 10.1088/1674-1056/28/6/068504

Design and fabrication of 10-kV silicon-carbide p-channel IGBTs with hexagonal cells and step space modulated junction termination extension

Zheng-Xin Wen(温正欣)1,2, Feng Zhang(张峰)1,2,3, Zhan-Wei Shen(申占伟)1, Jun Chen(陈俊)1,2, Ya-Wei He(何亚伟)1,2, Guo-Guo Yan(闫果果)1, Xing-Fang Liu(刘兴昉)1, Wan-Shun Zhao(赵万顺)1, Lei Wang(王雷)1, Guo-Sheng Sun(孙国胜)1,2, Yi-Ping Zeng(曾一平)1,2
1 Key Laboratory of Semiconductor Material Sciences, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;
2 College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China;
3 Department of Physics, Xiamen University, Xiamen 361005, China

10-kV 4H-SiC p-channel insulated gate bipolar transistors (IGBTs) are designed, fabricated, and characterized in this paper. The IGBTs have an active area of 2.25 mm2 with a die size of 3 mm×3 mm. A step space modulated junction termination extension (SSM-JTE) structure is introduced and fabricated to improve the blocking performance of the IGBTs. The SiC p-channel IGBTs with SSM-JTE termination exhibit a leakage current of only 50 nA at -10 kV. To improve the on-state characteristics of SiC IGBTs, the hexagonal cell (H-cell) structure is designed and compared with the conventional interdigital cell (I-cell) structure. At an on-state current of 50 A/cm2, the voltage drops of I-cell IGBT and H-cell IGBT are 10.1 V and 8.3 V respectively. Meanwhile, on the assumption that the package power density is 300 W/cm2, the maximum permissible current densities of the I-cell IGBT and H-cell IGBT are determined to be 34.2 A/cm2 and 38.9 A/cm2 with forward voltage drops of 8.8 V and 7.8 V, respectively. The differential specific on-resistance of I-cell structure and H-cell structure IGBT are 72.36 mΩ·cm2 and 56.92 mΩ·cm2, respectively. These results demonstrate that H-cell structure silicon carbide IGBT with SSM-JTE is a promising candidate for high power applications.

Keywords:  silicon carbide      power device      insulated gate bipolar transistors (IGBTs)      high voltage  
Received:  03 March 2019      Revised:  04 April 2019      Accepted manuscript online: 
PACS:  85.30.Tv (Field effect devices)  
  85.30.Pq (Bipolar transistors)  
  85.30.De (Semiconductor-device characterization, design, and modeling)  

Project supported by the National Basic Research Program of China (Grant No. 2015CB759600), the Science Challenge Project, China (Grant No. TZ2018003), the National Natural Science Foundation of China (Grant Nos. 61474113, 61574140, and 61804149), the Beijing NOVA Program, China (Grant Nos. 2016071 and Z181100006218121), the Beijing Municipal Science and Technology Commission Project, China (Grant No. Z161100002116018), and the Youth Innovation Promotion Association of Chinese Academy of Sciences (Grant No. 2012098).

Corresponding Authors:  Feng Zhang     E-mail:

Cite this article: 

Zheng-Xin Wen(温正欣), Feng Zhang(张峰), Zhan-Wei Shen(申占伟), Jun Chen(陈俊), Ya-Wei He(何亚伟), Guo-Guo Yan(闫果果), Xing-Fang Liu(刘兴昉), Wan-Shun Zhao(赵万顺), Lei Wang(王雷), Guo-Sheng Sun(孙国胜), Yi-Ping Zeng(曾一平) Design and fabrication of 10-kV silicon-carbide p-channel IGBTs with hexagonal cells and step space modulated junction termination extension 2019 Chin. Phys. B 28 068504

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