CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES |
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Thermal stability and electrical properties of copper nitride with In or Ti |
Du Yun (杜允)a b, Gao Lei (高磊)b, Li Chao-Rong (李超荣)c, Ji Ai-Ling (纪爱玲)b |
a Information Engineering School, Hangzhou Dianzi University, Hangzhou 310018, China; b State Key Laboratory for Surface Physics, Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; c School of Sciences, Zhejiang Sci-Tech University, Hangzhou 310018, China |
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Abstract Thin films of ternary compounds CuxInyN and CuxTiyN were grown by magnetron sputtering to improve the thermal stability of Cu3N, a material that decomposes below 300 ℃, and thus promises many interesting applications in directwriting. The effect of In or Ti incorporation in altering the structure and physical properties of copper nitride was evaluated by characterizing the film structure, surface morphology, and temperature dependence of electrical resistivity. More Ti than In can be accommodated by copper nitride without completely deteriorating the Cu3N lattice. A small amount of In or Ti can improve the crystallinity, and consequently the surface morphology. While the decomposition temperature is rarely influenced by In, the Ti-doped sample, Cu59.31Ti2.64N38.05, shows an X-ray diffraction pattern dominated by characteristic Cu3N peaks, even after annealing at 500 ℃. Both In and Ti reduce the bandgap of the original Cu3N phase, resulting in a smaller electrical resistivity at room temperature. The samples with more Ti content manifest metal-semiconductor transition when cooled from room temperature down to 50 K. These results can be useful in improving the applicability of copper-nitride-based thin films.
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Received: 26 January 2013
Revised: 19 April 2013
Accepted manuscript online:
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PACS:
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68.55.Jk
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73.50.Bk
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(General theory, scattering mechanisms)
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81.05.Hd
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(Other semiconductors)
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Fund: Project supported by the National Natural Science Foundation of China (Grant Nos. 51172272, 10904165, and 11290161) and the National Basic Research Program of China (Grant No. 2012CB933002). |
Corresponding Authors:
Ji Ai-Ling
E-mail: alji@iphy.ac.cn
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Cite this article:
Du Yun (杜允), Gao Lei (高磊), Li Chao-Rong (李超荣), Ji Ai-Ling (纪爱玲) Thermal stability and electrical properties of copper nitride with In or Ti 2013 Chin. Phys. B 22 066804
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