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The fabrication and characterization of 4H SiC power UMOSFETs |
Song Qing-Wen (宋庆文)a b, Zhang Yu-Ming (张玉明)b, Han Ji-Sheng (韩吉胜)c, Philip Tannerc, Sima Dimitrijevc d, Zhang Yi-Men (张义门)b, Tang Xiao-Yan (汤晓燕)b, Guo Hui (郭辉)b |
a School of Technical Physics, Xidian University, Xi'an 710071, China; b Key Laboratory of Wide Band Gap Semiconductor Materials and Devices, Xidian University, Xi'an 710071, China; c Queensland Micro and Nanotechnology Center, Griffith University, Nathan 4111, Australia; d Griffith School of Engineering, Griffith University, Nathan 4111, Australia |
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Abstract The fabrication of 4H-SiC vertical trench-gate metal-oxide-semiconductor field-effect transistors (UMOSFETs) is reported in this paper. The device has a 15-μm thick drift layer with 3×1015 cm-3 N-type doping concentration and a 3.1-μm channel length. The measured on-state source-drain current density is 65.4 A/cm2 at Vg=40 V and VDS=15 V. The measured threshold voltage (Vth) is 5.5 V by linear extrapolation from the transfer characteristics. A specific on-resistance (Rsp-on) is 181 mΩ·cm2 at Vg=40 V and a blocking voltage (BV) is 880 V (IDS=100 μA@880V) at Vg=0 V.
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Received: 22 August 2012
Revised: 19 November 2012
Accepted manuscript online:
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PACS:
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73.40.-c
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(Electronic transport in interface structures)
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73.40.Qv
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(Metal-insulator-semiconductor structures (including semiconductor-to-insulator))
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73.61.Le
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(Other inorganic semiconductors)
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Fund: Project supported by the National Natural Science Foundation of China (Grant Nos. 61176070 and 61274079); the Doctoral Fund of Ministry of Education of China (Grant No. 20110203110010); and the Key Specific Projects of Ministry of Education of China (Grant No. 625010101). |
Cite this article:
Song Qing-Wen (宋庆文), Zhang Yu-Ming (张玉明), Han Ji-Sheng (韩吉胜), Philip Tanner, Sima Dimitrijev, Zhang Yi-Men (张义门), Tang Xiao-Yan (汤晓燕), Guo Hui (郭辉) The fabrication and characterization of 4H SiC power UMOSFETs 2013 Chin. Phys. B 22 027302
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