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Chin. Phys. B, 2013, Vol. 22(11): 116804    DOI: 10.1088/1674-1056/22/11/116804
CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES Prev   Next  

Effects of high temperature rapid thermal annealing on Ge films grown on Si(001) substrate

Liu Zhi (刘智), Cheng Bu-Wen (成步文), Li Ya-Ming (李亚明), Li Chuan-Bo (李传波), Xue Chun-Lai (薛春来), Wang Qi-Ming (王启明)
State Key Laboratory on Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
Abstract  Tensile strain, crystal quality, and surface morphology of 500 nm thick Ge films were improved after rapid thermal annealing at 900 ℃ for a short period (< 20 s). The films were grown on Si(001) substrates by ultra-high vacuum chemical vapor deposition. These improvements are attributed to relaxation and defect annihilation in the Ge films. However, after prolonged (>20 s) rapid thermal annealing, tensile strain and crystal quality degenerated. This phenomenon results from intensive Si–Ge mixing at high temperature.
Keywords:  Ge film      rapid thermal annealing      tensile strain      Si–Ge mixing  
Received:  18 April 2013      Revised:  14 June 2013      Accepted manuscript online: 
PACS:  68.55.ag (Semiconductors)  
  65.40.De (Thermal expansion; thermomechanical effects)  
  68.37.Ps (Atomic force microscopy (AFM))  
Fund: Project supported by the National Basic Research Program of China (Grant No. 2013CB632103) and the National Natural Science Foundation of China (Grant Nos. 61036003, 61176013, and 61177038).
Corresponding Authors:  Cheng Bu-Wen     E-mail:  cbw@semi.ac.cn

Cite this article: 

Liu Zhi (刘智), Cheng Bu-Wen (成步文), Li Ya-Ming (李亚明), Li Chuan-Bo (李传波), Xue Chun-Lai (薛春来), Wang Qi-Ming (王启明) Effects of high temperature rapid thermal annealing on Ge films grown on Si(001) substrate 2013 Chin. Phys. B 22 116804

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