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Chinese Physics, 2006, Vol. 15(11): 2746-2750    DOI: 10.1088/1009-1963/15/11/048
CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES Prev   Next  

Experimental study of surface crystallization on integrated circuit chips

Zhang Xin(张新)a)b)†, Liu Meng-Xin(刘梦新)a), Gao Yong(高勇)a), Wang Cai-Lin (王彩琳)a), Wang Zhi-Wei(王峙卫)b), and Zhang Xian(张弦)b)
a Xi'an University of Technology, Xi'an 710048, China; b East China Institute of Photo-Electron IC, Bengbu 233042, China
Abstract  A surface crystallization phenomenon on bonding pads and wires of integrated circuit chip is reported in this paper. Through a lot of experiments, an unknown failure effect caused by mixed crystalline matter is revealed, whereas non-plasma fluorine contamination cannot cause the failure of bonding pads. By experiments combined with infrared spectroscopy analysis, the surface crystallization effect is studied. The conclusion of the study can provide the guidance for IC fabrication, modelling and analysis.
Keywords:  infrared spectrum technology      bonding pad      crystallization      failure  
Received:  07 January 2006      Revised:  27 May 2006      Accepted manuscript online: 
PACS:  85.40.-e (Microelectronics: LSI, VLSI, ULSI; integrated circuit fabrication technology)  
  78.30.-j (Infrared and Raman spectra)  

Cite this article: 

Zhang Xin(张新), Liu Meng-Xin(刘梦新), Gao Yong(高勇), Wang Cai-Lin (王彩琳), Wang Zhi-Wei(王峙卫), and Zhang Xian(张弦) Experimental study of surface crystallization on integrated circuit chips 2006 Chinese Physics 15 2746

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