Chin. Phys. B
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Chin. Phys. B  2019, Vol. 28 Issue (7): 078105    DOI: 10.1088/1674-1056/28/7/078105
INTERDISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY Current Issue| Next Issue| Archive| Adv Search |
Thermal conductivity characterization of ultra-thin silicon film using the ultra-fast transient hot strip method
Yan-Yan Zhang(张燕燕)1, Ran Cheng(程然)1, Dong Ni(倪东)2, Ming Tian(田明)3, Ji-Wu Lu(卢继武)4, Yi Zhao(赵毅)1
1 College of Information Science and Electronic Engineering, Zhejiang University, Hangzhou 310027, China;
2 State Key Laboratory of Industrial Control Technology, Zhejiang University, Hangzhou 310027, China;
3 Shanghai Huali Microelectronics Corporation, Shanghai 200120, China;
4 College of Electrical and Information Engineering, Hunan University, Changsha 410082, China

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