Yield strength of attached copper film

doi:10.1088/1674-1056/20/8/086802

Abstract Variation of stress in attached copper film with an applied strain is measured by X-ray diffraction combined with a four-point bending method. A lower slope of the initial elastic segment of the curve of X-ray measured stress versus applied strain results from incomplete elastic strain transferred from the substrate to the film due to insufficiently strong interface cohesion. So the slope of the initial elastic segment of the X-ray stress (or X-ray strain directly) of the film against the substrate applied strain may be used to measure the film-substrate cohesive strength. The yield strength of the attached copper film is much higher than that of the bulk material and varies linearly with the inverse of the film thickness.

Keywords: copper film yield strength X-ray diffraction

Received: 08 January 2011
Revised: 29 March 2011
Accepted manuscript online:

PACS:	68.55.-a	(Thin film structure and morphology)
	81.40.Lm	(Deformation, plasticity, and creep)
	68.60.Bs	(Mechanical and acoustical properties)
	61.05.cp	(X-ray diffraction)

Fund: Project supported by the State Key Development Program for Basic Research of China (Grant No. 2004CB619302) and the National Natural Science Foundation of China (Grant No. 51071098).

Cite this article:

Zhang Yan(张研) and Zhang Jian-Min(张建民) Yield strength of attached copper film 2011 Chin. Phys. B 20 086802

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Yield strength of attached copper film

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