Abstract A surface crystallization phenomenon on bonding pads and wires of integrated circuit chip is reported in this paper. Through a lot of experiments, an unknown failure effect caused by mixed crystalline matter is revealed, whereas non-plasma fluorine contamination cannot cause the failure of bonding pads. By experiments combined with infrared spectroscopy analysis, the surface crystallization effect is studied. The conclusion of the study can provide the guidance for IC fabrication, modelling and analysis.
Received: 07 January 2006
Revised: 27 May 2006
Accepted manuscript online:
Zhang Xin(张新), Liu Meng-Xin(刘梦新), Gao Yong(高勇), Wang Cai-Lin (王彩琳), Wang Zhi-Wei(王峙卫), and Zhang Xian(张弦) Experimental study of surface crystallization on integrated circuit chips 2006 Chinese Physics 15 2746
Altmetric calculates a score based on the online attention an article receives. Each coloured thread in the circle represents a different type of online attention. The number in the centre is the Altmetric score. Social media and mainstream news media are the main sources that calculate the score. Reference managers such as Mendeley are also tracked but do not contribute to the score. Older articles often score higher because they have had more time to get noticed. To account for this, Altmetric has included the context data for other articles of a similar age.
