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Removing paint from a metal substrate using a flattened top laser |
Shi Shu-Dong (施曙东)a d, Li Wei (李伟)a, Du Peng (杜鹏)a, Wang Meng (王萌)a, Song Feng (宋峰)a, Liu Shu-Jing (刘淑静)b, Chen Nian-Jiang (陈念江)c, Zhao Hong (赵鸿)c, Yang Wen-Shi (杨文是)c |
a School of Physics, Nankai University, Tianjin 300071, China; b Department of Physics, College of Basic Medical Sciences, Tianjin Medical University, Tianjin 300070, China; c Science and Technology on Solid-State Laser Laboratory, Beijing 100015, China; d Electricity Department, Patent Office, Beijing 100088, China |
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Abstract In this paper, we investigate laser cleaning using a flattened top laser to remove paint coating from a metal substrate. Under the irradiation of a flattened top laser, the coating paint of the metal substrate can be removed efficiently by laser induced ablation, stress, and displacement force. The temperature distribution, stress, and displacement are calculated in the coating layer and substrate using finite element analysis. The effects of a Gaussian laser and a flattened top laser and the results of different diameters of laser spot are compared. The investigation shows that the flattened top laser can reduce the substrate damage and enhance the cleaning efficiency. This method meets the need of large area industrial cleaning applications by optimizing the flattened top laser parameters.
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Received: 22 March 2012
Revised: 08 April 2012
Accepted manuscript online:
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PACS:
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42.62.-b
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(Laser applications)
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52.38.Mf
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(Laser ablation)
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79.20.Eb
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(Laser ablation)
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Fund: Project supported by the Industrial Technology Development Program, China (Grant No. A1120110023) and the National Key Laboratory of Solid-state-laser Technology, China (Grant No. 9140C040201100C04). |
Corresponding Authors:
Song Feng
E-mail: fsong@nankai.edu.cn
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Cite this article:
Shi Shu-Dong (施曙东), Li Wei (李伟), Du Peng (杜鹏), Wang Meng (王萌), Song Feng (宋峰), Liu Shu-Jing (刘淑静), Chen Nian-Jiang (陈念江), Zhao Hong (赵鸿), Yang Wen-Shi (杨文是) Removing paint from a metal substrate using a flattened top laser 2012 Chin. Phys. B 21 104209
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