Chin. Phys. B
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Chin. Phys. B  2009, Vol. 18 Issue (11): 4995    DOI: 10.1088/1674-1056/18/11/063
CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES Current Issue| Next Issue| Archive| Adv Search |
A novel analytical thermal model for multilevel nano-scale interconnects considering the via effect
Zhu Zhang-Ming, Li Ru, Hao Bao-Tian, Yang Yin-Tang
Microelectronics Institute, Xidian University, Xi'an 710071, China

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