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Thermal stress damage mechanism in single-crystal germanium caused by 1080 nm laser irradiation |
| Yin-Chuan Sha(沙银川)1,†, Ze-Wen Li(李泽文)1,†‡, Zhi-Chao Jia(贾志超)2, Bing Han(韩冰)3, and Xiao-Wu Ni(倪晓武)1 |
1 School of Science, Nanjing University of Science and Technology, Nanjing 210094, China;
2 School of Materials Engineering, Jinling Institute of Technology, Nanjing 211169, China;
3 School of Electronic Engineering and Optical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China |
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Abstract The process of thermal stress damage during 1080 nm laser ablation of single-crystal germanium was recorded in real time using a high-speed charge-coupled device. A three-dimensional finite element numerical model based on Fourier's heat conduction equation, Hooke's law and the Alexander-Hasson equation was developed to analyze the thermal stress damage mechanism involved. The damage morphology of the ablated samples was observed using an optical microscope. The results show that the cooling process has an important influence on fracture in the laser-irradiated region of single-crystal germanium. Fracture is the result of a combination of thermal stress and reduction in local yield strength.
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Received: 16 June 2022
Revised: 13 January 2023
Accepted manuscript online: 18 January 2023
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PACS:
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61.82.Fk
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(Semiconductors)
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61.80.Ba
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(Ultraviolet, visible, and infrared radiation effects (including laser radiation))
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61.80.-x
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(Physical radiation effects, radiation damage)
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52.38.Mf
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(Laser ablation)
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Corresponding Authors:
Ze-Wen Li
E-mail: lizewen.njust@gmail.com
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Cite this article:
Yin-Chuan Sha(沙银川), Ze-Wen Li(李泽文), Zhi-Chao Jia(贾志超), Bing Han(韩冰), and Xiao-Wu Ni(倪晓武) Thermal stress damage mechanism in single-crystal germanium caused by 1080 nm laser irradiation 2023 Chin. Phys. B 32 106104
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