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Chinese Physics, 2005, Vol. 14(5): 1006-1010    DOI: 10.1088/1009-1963/14/5/026
CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES Prev   Next  

Internal stress and yield strength of copper films on substrates

Zhang Jian-Min (张建民)a, Zhang Yan (张研)a, Xu Ke-Wei (徐可为)b
a College of Physics and Information Technology, Shaanxi Normal University, Xi’an 710062, China; b State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an 710049, China
Abstract  Internal stress and yield strength of pure copper films on substrates were characterized by X-ray diffraction and thermal-cycle substrate curvature methods. The internal stress was of tension, and decreased with increasing working-gas (argon) pressure and increased with increasing film thickness. Tensile yield strength of copper film on steel substrate was reciprocal to the film thickness. Similarly, the compressive yield strength depended strongly on the film thickness, the thinner the film thickness, the larger the compressive yield strength.
Keywords:  copper film      internal stress      yield strength      X-ray diffraction      thermal-cycle substrate curvature  
Received:  23 December 2003      Revised:  16 December 2004      Accepted manuscript online: 
PACS:  6110  
  6114  
  7340  
  7360D  
Fund: Project supported by the National Natural Science Foundation of China (Grant No 50271038)

Cite this article: 

Zhang Jian-Min (张建民), Zhang Yan (张研), Xu Ke-Wei (徐可为) Internal stress and yield strength of copper films on substrates 2005 Chinese Physics 14 1006

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