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Bridge-free fabrication process for Al/AlOx/Al Josephson junctions |
| Ke Zhang(张珂)1, Meng-Meng Li(李蒙蒙)1, Qiang Liu(刘强)1, Hai-Feng Yu(于海峰)1,2, Yang Yu(于扬)1,2 |
1 National Laboratory of Solid State Microstructures, School of Physics, Nanjing University, Nanjing 210093, China;
2 Synergetic Innovation Center of Quantum Information & Quantum Physics, University of Science and Technology of China, Hefei 230026, China |
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Abstract We fabricate different-sized Al/AlOx/Al Josephson junctions by using a simple bridge-free technique, in which only single-layer E-beam resist polymethyl methacrylate (PMMA) is exposed at low accelerate voltage (below 30 kV) and the size of junction can be varied in a large range. Compared with the bridge technique, this fabrication process is very robust because it can avoid collapsing the bridge during fabrication. This makes the bridge-free technique more popular to meet different requirements for Josephson junction devices especially for superconducting quantum bits.
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Received: 07 March 2017
Revised: 05 April 2017
Accepted manuscript online:
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PACS:
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85.25.Cp
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(Josephson devices)
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03.67.Lx
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(Quantum computation architectures and implementations)
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85.25.Am
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(Superconducting device characterization, design, and modeling)
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| Fund: Project supported by the National Key Research and Development Program of China (Grant No.2016YFA0301802) and the National Natural Science Foundation of China (Grant Nos.11474152,91321310,11274156,11504165,and 61521001). |
Corresponding Authors:
Hai-Feng Yu
E-mail: hfyu@nju.edu.cn
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Cite this article:
Ke Zhang(张珂), Meng-Meng Li(李蒙蒙), Qiang Liu(刘强), Hai-Feng Yu(于海峰), Yang Yu(于扬) Bridge-free fabrication process for Al/AlOx/Al Josephson junctions 2017 Chin. Phys. B 26 078501
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