Abstract On the silicon-on-insulator platform, an ultra compact temperature-insensitive modulator based on cascaded microring assistant Mach-Zehnder interferometer is proposed and demonstrated with numerical simulation. According to the calculated results, the tolerated variation of ambient temperature can be as high as 134℃ while the footprint of such silicon modulator is only 340 μm2.
(Interconnects, including holographic interconnects)
Fund: Project supported by the National Basic Research Program of China (Grant Nos. 2011CBA00608, 2011CBA00303, 2011CB301803, and 2010CB327405), the National Natural Science Foundation of China (Grant Nos. 61036011 and 61036010), and the Project of Science and Technology on Communication Information Security Control Laboratory.
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