Internal stress and yield strength of copper films on substrates
Zhang Jian-Min (张建民)a, Zhang Yan (张研)a, Xu Ke-Wei (徐可为)b
a College of Physics and Information Technology, Shaanxi Normal University, Xi’an 710062, China; b State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an 710049, China
Abstract Internal stress and yield strength of pure copper films on substrates were characterized by X-ray diffraction and thermal-cycle substrate curvature methods. The internal stress was of tension, and decreased with increasing working-gas (argon) pressure and increased with increasing film thickness. Tensile yield strength of copper film on steel substrate was reciprocal to the film thickness. Similarly, the compressive yield strength depended strongly on the film thickness, the thinner the film thickness, the larger the compressive yield strength.
Received: 23 December 2003
Revised: 16 December 2004
Accepted manuscript online:
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