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Chin. Phys. B, 2016, Vol. 25(4): 048502    DOI: 10.1088/1674-1056/25/4/048502
INTERDISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY Prev   Next  

Ultra-low specific on-resistance high-voltage vertical double diffusion metal-oxide-semiconductor field-effect transistor with continuous electron accumulation layer

Da Ma(马达)1, Xiao-Rong Luo(罗小蓉)1,2, Jie Wei(魏杰)1, Qiao Tan(谭桥)1, Kun Zhou(周坤)1, Jun-Feng Wu(吴俊峰)1
1 State Key Laboratory of Electronic Thin Films and Integrated Devices. University of Electronic Science and Technology of China, Chengdu 610054, China;
2 Science and Technology on Analog Integrated Circuit Laboratory, Chongqing 400060, China
Abstract  A new ultra-low specific on-resistance (Ron,sp) vertical double diffusion metal-oxide-semiconductor field-effect transistor (VDMOS) with continuous electron accumulation (CEA) layer, denoted as CEA-VDMOS, is proposed and its new current transport mechanism is investigated. It features a trench gate directly extended to the drain, which includes two PN junctions. In on-state, the electron accumulation layers are formed along the sides of the extended gate and introduce two continuous low-resistance current paths from the source to the drain in a cell pitch. This mechanism not only dramatically reduces the Ron,sp but also makes the Ron,sp almost independent of the n-pillar doping concentration (Nn). In off-state, the depletion between the n-pillar and p-pillar within the extended trench gate increases the Nn, and further reduces the Ron,sp. Especially, the two PN junctions within the trench gate support a high gate-drain voltage in the off-state and on-state, respectively. However, the extended gate increases the gate capacitance and thus weakens the dynamic performance to some extent. Therefore, the CEA-VDMOS is more suitable for low and medium frequencies application. Simulation indicates that the CEA-VDMOS reduces the Ron,sp by 80% compared with the conventional super-junction VDMOS (CSJ-VDMOS) at the same high breakdown voltage (BV).
Keywords:  electron accumulation layer      PN junctions      low specific on-resistance      high breakdown voltage  
Received:  12 October 2015      Revised:  15 December 2015      Accepted manuscript online: 
PACS:  85.30.De (Semiconductor-device characterization, design, and modeling)  
  85.30.Tv (Field effect devices)  
  85.30.Mn (Junction breakdown and tunneling devices (including resonance tunneling devices))  
Fund: Project supported by the National Natural Science Foundation of China (Grant Nos. 61176069 and 61376079) and the Fundamental Research Funds for the Central Universities, China (Grant No. ZYGX2014Z006).
Corresponding Authors:  Xiao-Rong Luo     E-mail:  xrluo@uestc.edu.cn

Cite this article: 

Da Ma(马达), Xiao-Rong Luo(罗小蓉), Jie Wei(魏杰), Qiao Tan(谭桥), Kun Zhou(周坤), Jun-Feng Wu(吴俊峰) Ultra-low specific on-resistance high-voltage vertical double diffusion metal-oxide-semiconductor field-effect transistor with continuous electron accumulation layer 2016 Chin. Phys. B 25 048502

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