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Thermal and mechanical characterizations of a substrate-free focal plane array |
Cheng Teng(程腾)a), Zhang Qing-Chuan(张青川) a)†, Chen Da-Peng(陈大鹏)b), Shi Hai-Tao(史海涛)a), Gao Jie(高杰)a), Qian Jian(钱剑)a), and Wu Xiao-Ping(伍小平)a) |
a CAS Key Laboratory of Mechanical Behavior and Design of Materials, University of Science and Technology of China, Hefei 230027, China; b Institute of Microelectronics, Chinese Academy of Science, Beijing 100029, China |
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Abstract We propose a substrate-free focal plane array (FPA) in this paper. The solid substrate is completely removed, and the microcantilevers extend from a supporting frame. Using finite element analysis, the thermal and mechanical characterizations of the substrate-free FPA are presented. Because of the large decrease in thermal conductance, the supporting frame is temperature dependent, which brings out a unique feature: the lower the thermal conductance of the supporting frame is, the higher the energy conversion efficiency in the substrate-free FPA will be. The results from the finite element analyses are consistent with our measurements: two types of substrate-free FPAs with pixel sizes of 200× 200 and 60 × 60 μm2 are implemented in the proposed infrared detector. The noise equivalent temperature difference (NETD) values are experimentally measured to be 520 and 300~mK respectively. Further refinements are considered in various aspects, and the substrate-free FPA with a pixel size of 30 × 30 μm2 has a potential of achieving an NETD value of 10 mK.
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Received: 20 March 2009
Revised: 18 May 2009
Accepted manuscript online:
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PACS:
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07.57.Kp
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(Bolometers; infrared, submillimeter wave, microwave, and radiowave receivers and detectors)
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02.70.Dh
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(Finite-element and Galerkin methods)
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07.10.Cm
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(Micromechanical devices and systems)
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85.60.Gz
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(Photodetectors (including infrared and CCD detectors))
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Fund: Project supported by the National
Natural Science Foundation of China (Grant Nos. 10732080 and
10627201), and the National Basic Research Program of China (Grant
No. 2006CB300404). |
Cite this article:
Cheng Teng(程腾), Zhang Qing-Chuan(张青川), Chen Da-Peng(陈大鹏), Shi Hai-Tao(史海涛), Gao Jie(高杰), Qian Jian(钱剑), and Wu Xiao-Ping(伍小平) Thermal and mechanical characterizations of a substrate-free focal plane array 2010 Chin. Phys. B 19 010701
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