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Chin. Phys. B, 2012, Vol. 21(9): 094601    DOI: 10.1088/1674-1056/21/9/094601
ELECTROMAGNETISM, OPTICS, ACOUSTICS, HEAT TRANSFER, CLASSICAL MECHANICS, AND FLUID DYNAMICS Prev   Next  

Modelling of spall damage in ductile materials and its application to the simulation of plate impact on copper

Zhang Feng-Guo, Zhou Hong-Qiang, Hu Jun, Shao Jian-Li, Zhang Guang-Ca, Hong Tao, He Bin
Institute of Applied Physics and Computational Mathematics, Beijing 100094, China
Abstract  A statistical model of dynamic spall damage due to void nucleation and growth is proposed for ductile materials under intense loading, which takes into account inertia, elastic-plastic effect, and initial void size. To some extent, void interaction could be accounted for in this approach. Based on this model, the simulation of spall experiments for copper is performed with the Lagrangian finite element method. The simulation results are in good agreement with experimental data for the free surface velocity profile, stress record behind copper target, final porosity, and void concentrations across the target. The influence of elastic-plastic effect upon the damage evolution is explored. The correlation between the damage evolution and the history of the stress near the spall plane is also analyzed.
Keywords:  spall damage      ductile materials      free surface velocity      plate impact  
Received:  17 November 2011      Revised:  06 April 2012      Published:  01 August 2012
PACS:  46.50.+a (Fracture mechanics, fatigue and cracks)  
  46.40.-f (Vibrations and mechanical waves)  
Fund: Project supported by the Science and Technology Development Foundation of China Academy of Engineering Physics (Grant Nos. 2009A09027 and 2009A09006).
Corresponding Authors:  Zhang Feng-Guo     E-mail:  zhang_fengguo@iapcm.ac.cn

Cite this article: 

Zhang Feng-Guo, Zhou Hong-Qiang, Hu Jun, Shao Jian-Li, Zhang Guang-Ca, Hong Tao, He Bin Modelling of spall damage in ductile materials and its application to the simulation of plate impact on copper 2012 Chin. Phys. B 21 094601

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