Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

doi:10.1088/1674-1056/23/4/044601

Abstract This paper studies and compares the effects of pull-pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.

Keywords: solder joint fatigue life hysteresis energy SEM in-situ technology

Received: 04 June 2013
Revised: 25 August 2013
Accepted manuscript online:

PACS:	46.50.+a	(Fracture mechanics, fatigue and cracks)
	74.25.Jb	(Electronic structure (photoemission, etc.))
	62.20.M-	(Structural failure of materials)

Fund: Project supported by the National Basic Research Program of China (Grant No. 2010CB631006) and the National Natural Science Foundation of China (Grant Nos. 11072124 and 11272173).

Corresponding Authors: Ren Huai-Hui
E-mail: renhuaihui@foxmail.com

About author: 46.50.+a; 74.25.Jb; 62.20.M-

Cite this article:

Ren Huai-Hui (任淮辉), Wang Xi-Shu (王习术) Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads 2014 Chin. Phys. B 23 044601

[1]	Kim D G 2006 Microelectron. Eng. 83 2391
[2]	Qu X 2007 Microelectron. Reliab. 47 2197
[3]	Wang X S 2008 Int. J. Fracture 151 269
[4]	Wang X S 2011 Microelectron. Reliab. 51 1377
[5]	Ročak D 2007 Microelectron. Reliab. 47 986
[6]	Erinc M 2007 Int. J. Solids Struct. 44 5680
[7]	Wang X S 2003 Exp. Techniques 27 31
[8]	Agrawal R and Espinosa H D 2009 J. Micromech. Microeng. 131 41208
[9]	Liu Z L, Hu H Y, Fan T Y and Xing X S 2009 Chin. Phys. B 18 1283
[10]	Lee W W 2000 Microelectron. Reliab. 40 231
[11]	Roellig M 2007 Microelectron. Reliab. 47 187
[12]	Wang X S and Fan J H 2004 J. Mater. Sci. 39 2617
[13]	Wang X S 2005 Acta Metall. Sin. 41 1272
[14]	Wang X S and Fan J H 2006 Int. J. Fatigue 28 79
[15]	Evans J W 2000 Microelectron. Reliab. 40 1147
[16]	Zhang L 2004 Microelectron. Reliab. 44 5337
[17]	Sun P 2006 Solder. Surf. Mt. Tech. 18 4
[18]	Lai Y S 2007 Microelectron. Reliab. 47 111
[19]	Huang J G 2007 Mater. Trans. 48 2795
[20]	Nayeb-Hashemi H and Yang P H 2001 Int. J. Fatigue 23 325
[21]	Xue Y 2007 Eng. Fract. Mech. 74 2810
[22]	Kanchanomai C 2005 Mech. Mater. 37 1166

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Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

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