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Chin. Phys. B, 2025, Vol. 34(6): 067304    DOI: 10.1088/1674-1056/adc660
CONDENSED MATTER: ELECTRONIC STRUCTURE, ELECTRICAL, MAGNETIC, AND OPTICAL PROPERTIES Prev   Next  

Low leakage current β-Ga2O3 MOS capacitors with ALD deposited Al2O3 gate dielectric using ozone as precursor

Zheng-Yi Liao(廖正一)1, Pai-Wen Fang(方湃文)1, Xing Lu(卢星)1,†, Gang Wang(王钢)1, and Yan-Li Pei(裴艳丽)1,2,‡
1 State Key Laboratory of Optoelectronic Materials and Technologies, School of Electronics and Information Technology, Sun Yat-Sen University, Guangzhou 510006, China;
2 Foshan Institute of Sun Yat-Sen University, Foshan 528225, China
Abstract  Metal-insulator-semiconductor (MOS) capacitor is a key structure for high performance MOS field transistors (MOSFETs), requiring low leakage current, high breakdown voltage, and low interface states. In this paper, β-Ga2O3 MOS capacitors were fabricated with ALD deposited Al2O3 using H2O or ozone (O3) as precursors. Compared with the Al2O3 gate dielectric with H2O as ALD precursor, the leakage current for the O3 precursor case is decreased by two orders of magnitude, while it keeps the same level at the fixed charges, interface state density, and border traps. The SIMS tests show that Al2O3 with O3 as precursor contains more carbon impurities. The current transport mechanism analysis suggests that the C-H complex in Al2O3 with O3 precursor serves as deep energy trap to reduce the leakage current. These results indicate that the Al2O3/β-Ga2O3 MOS capacitor using the O3 precursor has a low leakage current and holds potential for application in β-Ga2O3 MOSFETs.
Keywords:  MOS capacitor      β-Ga2O3      ozone precursor      ALD Al2O3  
Received:  15 January 2025      Revised:  25 March 2025      Accepted manuscript online:  28 March 2025
PACS:  73.40.Qv (Metal-insulator-semiconductor structures (including semiconductor-to-insulator))  
  71.20.Nr (Semiconductor compounds)  
  81.15.-z (Methods of deposition of films and coatings; film growth and epitaxy)  
  77.55.D-  
Fund: Project supported in part by the Science and Technology Development Plan Project of Jilin Province, China (Grant No. YDZJ202303CGZH022), the National Key Research and Development Program of China (Grant No. 2024YFE0205300), the National Natural Science Foundation of China (Grant No. 62471504), and the Open Fund of the State Key Laboratory of Optoelectronic Materials and Technologies (Sun Yat-Sen University) (Grant No. OEMT-2023- KF-05).
Corresponding Authors:  Xing Lu, Yan-Li Pei     E-mail:  lux86@mail.sysu.edu.cn;peiyanli@mail.sysu.edu.cn

Cite this article: 

Zheng-Yi Liao(廖正一), Pai-Wen Fang(方湃文), Xing Lu(卢星), Gang Wang(王钢), and Yan-Li Pei(裴艳丽) Low leakage current β-Ga2O3 MOS capacitors with ALD deposited Al2O3 gate dielectric using ozone as precursor 2025 Chin. Phys. B 34 067304

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