Improving dynamic characteristics for IGBTs by using interleaved trench gate

doi:10.1088/1674-1056/ace15d

Abstract A novel trench insulated gate bipolar transistor (IGBT) with improved dynamic characteristics is proposed and investigated. The poly gate and poly emitter of the proposed IGBT are arranged alternately along the trench. A self-biased p-MOSFET is formed on the emitter side. Owing to this unique three-dimensional (3D) trench architecture, both the turn-off characteristic and the turn-on characteristic can be greatly improved. At the turn-off moment, the maximum electric field and impact ionization rate of the proposed IGBT decrease and the dynamic avalanche (DA) is suppressed. Comparing with the carrier-stored trench gate bipolar transistor (CSTBT), the turn-off loss (E_off) of the proposed IGBT also decreases by 31% at the same ON-state voltage. At the turn-on moment, the built-in p-MOSFET reduces the reverse displacement current (I_{G_dis}), which is conducive to lowing dI_C/dt. As a result, compared with the CSTBT with the same turn-on loss (E_on), at I_C = 20 A/cm², the proposed IGBT decreases by 35% of collector surge current (I_surge) and 52% of d I_C/dt.

Keywords: insulated gate bipolar transistor (IGBT) dynamic avalanche (DA) dI_C/dt

Received: 18 April 2023
Revised: 20 June 2023
Accepted manuscript online: 25 June 2023

PACS:	85.30.De	(Semiconductor-device characterization, design, and modeling)
	85.30.Tv	(Field effect devices)
	85.30.Pq	(Bipolar transistors)

Fund: Project supported by the Natural Science Foundation of Hunan Province, China (Grant No.2023JJ40161), the Natural Science Foundation of Changsha, China (Grant No.kq2202163), the National Natural Science Foundation of China (Grant No.U21A20499), and the Fundamental Research Funds for the Central Universities, China (Grant No.531118010735).

Corresponding Authors: Gao-Qiang Deng
E-mail: gqdeng@hnu.edu.cn

Cite this article:

Yi-Fan Wu(吴毅帆), Gao-Qiang Deng(邓高强), Chen Tan(谭琛), Shi-Wei Liang(梁世维), and Jun Wang(王俊) Improving dynamic characteristics for IGBTs by using interleaved trench gate 2023 Chin. Phys. B 32 128503

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