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Residual stress induced wetting variation on electric brush-plated Cu film |
Meng Ke-Ke (孟可可), Jiang Yue (江月), Jiang Zhong-Hao (江忠浩), Lian Jian-She (连建设), Jiang Qing (蒋青) |
Key Laboratory of Automobile Materials, Department of Materials Science and Engineering, Jilin University, Changchun 130025, China |
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Abstract Nanocrystalline Cu film with a mirror surface finishing is prepared by the electric brush-plating technique. The as-prepared Cu film exhibits a superhydrophilic behavior with an apparent water contact angle smaller than 10°. A subsequent increase in the water contact angle and a final wetting transition from inherent hydrophilicity with water contact angle smaller than 90° to apparent hydrophobicity with water contact angle larger than 90° are observed when the Cu film is subjected to natural aging. Analysis based on the measurement of hardness with nanoindentation and the theory of the bond-order-length-strength correlation reveals that this wetting variation on the Cu film is attributed to the relaxation of residual stress generated during brush-plating deposition and a surface hydrophobization role associated with the broken bond polarization induced by surface nanostructure.
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Received: 04 July 2013
Revised: 08 November 2013
Accepted manuscript online:
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PACS:
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82.70.Uv
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(Surfactants, micellar solutions, vesicles, lamellae, amphiphilic systems, (hydrophilic and hydrophobic interactions))
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61.30.Hn
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(Surface phenomena: alignment, anchoring, anchoring transitions, surface-induced layering, surface-induced ordering, wetting, prewetting transitions, and wetting transitions)
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83.85.St
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(Stress relaxation ?)
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62.20.Qp
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(Friction, tribology, and hardness)
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Fund: Project supported by the National Natural Science Foundations of China (Grant No. 51371089) and the Foundation of National Key Basic Research and Development Program of China (Grant No. 2010CB 631001). |
Corresponding Authors:
Jiang Zhong-Hao
E-mail: jzh@jlu.edu.cn
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Cite this article:
Meng Ke-Ke (孟可可), Jiang Yue (江月), Jiang Zhong-Hao (江忠浩), Lian Jian-She (连建设), Jiang Qing (蒋青) Residual stress induced wetting variation on electric brush-plated Cu film 2014 Chin. Phys. B 23 038201
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