Please wait a minute...
Chinese Physics, 2005, Vol. 14(3): 565-570    DOI: 10.1088/1009-1963/14/3/025
CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES Prev   Next  

Effect of the technology of implanting nitrogen into buried oxide on the radiation hardness of the top gate oxide for partially depleted SOI PMOSFET

Zheng Zhong-Shan (郑中山)ac, Liu Zhong-Li (刘忠立)a, Zhang Guo-Qiang (张国强)a, Li Ning (李宁)a, Fan Kai (范楷)a, Zhang En-Xia (张恩霞)b, Yi Wan-Bing (易万兵)b, Chen Meng (陈猛)b, Wang Xi (王曦)b
a Microelectronics R&D Center, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China; b Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, Chinac Department of Physics, Jinan University, Jinan 250022, China
Abstract  The effect of implanting nitrogen into buried oxide on the top gate oxide hardness against total irradiation does has been investigated with three nitrogen implantation doses (8×1015, 2×1016 and 1×1017cm-2) for partially depleted SOI PMOSFET. The experimental results reveal the trend of negative shift of the threshold voltages of the studied transistors with the increase of nitrogen implantation dose before irradiation. After the irradiation with a total dose of 5×105rad(Si) under a positive gate voltage of 2V, the threshold voltage shift of the transistors corresponding to the nitrogen implantation dose 8×1015cm-2 is smaller than that of the transistors without implantation. However, when the implantation dose reaches 2×1016 and 1×1017cm-2, for the majority of the tested transistors, their top gate oxide was badly damaged due to irradiation. In addition, the radiation also causes damage to the body-drain junctions of the transistors with the gate oxide damaged. All the results can be interpreted by tracing back to the nitrogen implantation damage to the crystal lattices in the top silicon.
Keywords:  SOIPMOSFET      radiation hardness      nitrogen implantation      threshold voltage shift  
Received:  09 July 2004      Revised:  04 August 2004      Accepted manuscript online: 
PACS:  85.30.Tv (Field effect devices)  
  73.40.Qv (Metal-insulator-semiconductor structures (including semiconductor-to-insulator))  
  85.40.Ry (Impurity doping, diffusion and ion implantation technology)  
  61.72.uf (Ge and Si)  
  85.30.De (Semiconductor-device characterization, design, and modeling)  

Cite this article: 

Zheng Zhong-Shan (郑中山), Liu Zhong-Li (刘忠立), Zhang Guo-Qiang (张国强), Li Ning (李宁), Fan Kai (范楷), Zhang En-Xia (张恩霞), Yi Wan-Bing (易万兵), Chen Meng (陈猛), Wang Xi (王曦) Effect of the technology of implanting nitrogen into buried oxide on the radiation hardness of the top gate oxide for partially depleted SOI PMOSFET 2005 Chinese Physics 14 565

[1] Total dose radiation response of modified commercial silicon-on-insulator materials with nitrogen implanted buried oxide
Zheng Zhong-Shan (郑中山), Liu Zhong-Li (刘忠立), Yu Fang (于芳), Li Ning (李宁 ). Chin. Phys. B, 2012, 21(11): 116104.
[2] Influence of nitrogen implantation into the buried oxide on the radiation hardness of silicon-on-insulator wafers
Tang Hai-Ma(唐海马), Zheng Zhong-Shan(郑中山), Zhang En-Xia(张恩霞), Yu Fang(于芳), Li Ning(李宁), and Wang Ning-Juan(王宁娟). Chin. Phys. B, 2010, 19(10): 106106.
No Suggested Reading articles found!