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Chin. Phys. B, 2014, Vol. 23(6): 066102    DOI: 10.1088/1674-1056/23/6/066102
CONDENSED MATTER: STRUCTURAL, MECHANICAL, AND THERMAL PROPERTIES Prev   Next  

Electrohydrodynamic direct-writing of conductor-insulator-conductor multi-layer interconnection

Zheng Gao-Fenga, Pei Yan-Boa b, Wang Xianga, Zheng Jian-Yia, Sun Dao-Henga
a Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361005, China;
b School of Mechanical and Electrical Engineering, Harbin Institute of Technology, Harbin 150001, China
Abstract  A multi-layer interconnection structure is a basic component of electronic devices, and printing of the multi-layer interconnection structure is the key process in printed electronics. In this work, electrohydrodynamic direct-writing (EDW) is utilized to print the conductor-insulator-conductor multi-layer interconnection structure. Silver ink is chosen to print the conductor pattern, and a polyvinylpyrrolidone (PVP) solution is utilized to fabricate the insulator layer between the bottom and top conductor patterns. The influences of EDW process parameters on the line width of the printed conductor and insulator patterns are studied systematically. The obtained results show that the line width of the printed structure increases with the increase of the flow rate, but decreases with the increase of applied voltage and PVP content in the solution. The average resistivity values of the bottom and top silver conductor tracks are determined to be 1.34×10-7 Ω·m and 1.39×10-7 Ω·m, respectively. The printed PVP layer between the two conductor tracks is well insulated, which can meet the insulation requirement of the electronic devices. This study offers an alternative, fast, and cost-effective method of fabricating conductor-insulator-conductor multi-layer interconnections in the electronic industry.
Keywords:  electrohydrodynamic direct-writing      multi-layer interconnection      all inkjet printing      jet printing     
Received:  12 September 2013      Published:  15 June 2014
PACS:  61.30.Pq (Microconfined liquid crystals: droplets, cylinders, randomly confined liquid crystals, polymer dispersed liquid crystals, and porous systems)  
  81.16.-c (Methods of micro- and nanofabrication and processing)  
  85.40.-e (Microelectronics: LSI, VLSI, ULSI; integrated circuit fabrication technology)  
  94.20.Ss (Electric fields; current system)  
Fund: Project supported by the Key Program of the National Natural Science Foundation of China (Grant No. 51035002), the National Natural Science Foundation of China (Grant No. 51305373), and the Specialized Research Fund for the Doctoral Program of Higher Education of China (Grant No. 20120121120035).
Corresponding Authors:  Zheng Jian-Yi     E-mail:  zjy@xmu.edu.cn

Cite this article: 

Zheng Gao-Feng, Pei Yan-Bo, Wang Xiang, Zheng Jian-Yi, Sun Dao-Heng Electrohydrodynamic direct-writing of conductor-insulator-conductor multi-layer interconnection 2014 Chin. Phys. B 23 066102

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