Thermal diffusivity of light-emitting diode packaging material determined by photoacoustic piezoelectric technique

doi:10.1088/1674-1056/19/11/118103

Abstract Thermal property is one of the most important properties of light-emitting diode (LED). Thermal property of LED packaging material determines the heat dissipations of the phosphor and the chip surface, accordingly having an influence on the light-emitting efficiency and the life-span of the device. In this paper, photoacoustic piezoelectric (PAPE) technique has been employed to investigate the thermal properties of polyvinyl alcohol (PVA) and silicon dioxide, which are the new and the traditional packaging materials in white LED, respectively. Firstly, the theory of PAPE technique has been developed for two-layer model in order to investigate soft materials; secondly, the experimental system has been set up and adjusted by measuring the reference sample; thirdly, the thermal diffusivities of PVA and silicon dioxide are measured and analysed. The experimental results show that PVA has a higher thermal diffusivity than silicon dioxide and is a better packaging material in the sense of thermal diffusivity for white LED.

Keywords: thermal diffusivity photoacoustic piezoelectric technique two-layer model LED packaging material

Received: 19 October 2009
Revised: 05 May 2010
Accepted manuscript online:

PACS:	85.60.Bt	(Optoelectronic device characterization, design, and modeling)
	85.60.Jb	(Light-emitting devices)

Fund: Project supported by the National Nature Science Foundation of China (Grant No. 50506006), the National High Technology Research and Development Program of China (Grant No. 2006AA03A116), and the Youth Foundation of University of Electronic Science and Technology of China (Grant No. JX05024).

Cite this article:

Sun Qi-Ming(孙启明), Gao Chun-Ming(高椿明), Zhao Bin-Xing(赵斌兴), and Rao Hai-Bo(饶海波) Thermal diffusivity of light-emitting diode packaging material determined by photoacoustic piezoelectric technique 2010 Chin. Phys. B 19 118103

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Thermal diffusivity of light-emitting diode packaging material determined by photoacoustic piezoelectric technique

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