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Chin. Phys. B, 2021, Vol. 30(1): 018501    DOI: 10.1088/1674-1056/abb30d

Influences of increasing gate stem height on DC and RF performances of InAlAs/InGaAs InP-based HEMTs

Zhi-Hang Tong(童志航)1,2, Peng Ding(丁芃)1,2, Yong-Bo Su(苏永波)1,2, Da-Hai Wang(王大海)1, and Zhi Jin(金智)1,2,
1 High-Frequency High-Voltage Device and Integrated Circuits Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China; 2 University of Chinese Academic of Sciences, Beijing 100049, China
Abstract  The T-gate stem height of InAlAs/InGaAs InP-based high electron mobility transistor (HEMT) is increased from 165 nm to 250 nm. The influences of increasing the gate stem height on the direct current (DC) and radio frequency (RF) performances of device are investigated. A 120-nm-long gate, 250-nm-high gate stem device exhibits a higher threshold voltage (V th) of 60 mV than a 120-nm-long gate devices with a short gate stem, caused by more Pt distributions on the gate foot edges of the high Ti/Pt/Au gate. The Pt distribution in Schottky contact metal is found to increase with the gate stem height or the gate length increasing, and thus enhancing the Schottky barrier height and expanding the gate length,which can be due to the increased internal tensile stress of Pt. The more Pt distributions for the high gate stem device also lead to more obvious Pt sinking, which reduces the distance between the gate and the InGaAs channel so that the transconductance (g m) of the high gate stem device is 70 mS/mm larger than that of the short stem device. As for the RF performances, the gate extrinsic parasitic capacitance decreases and the intrinsic transconductance increases after the gate stem height has been increased, so the RF performances of device are obviously improved. The high gate stem device yields a maximum f t of 270 GHz and f max of 460 GHz, while the short gate stem device has a maximum f t of 240 GHz and the f max of 370 GHz.
Keywords:  InP-based HEMT      gate stem height      Pt/Ti Schottky contact      gate parasitic capacitances  
Received:  26 May 2020      Revised:  30 July 2020      Accepted manuscript online:  27 August 2020
PACS:  85.30.Tv (Field effect devices)  
  73.40.Qv (Metal-insulator-semiconductor structures (including semiconductor-to-insulator))  
  85.30.-z (Semiconductor devices)  
Fund: Project supported by the National Natural Science Foundation of China (Grant No. 61434006).
Corresponding Authors:  Corresponding author. E-mail:   

Cite this article: 

Zhi-Hang Tong(童志航), Peng Ding(丁芃), Yong-Bo Su(苏永波), Da-Hai Wang(王大海), and Zhi Jin(金智) Influences of increasing gate stem height on DC and RF performances of InAlAs/InGaAs InP-based HEMTs 2021 Chin. Phys. B 30 018501

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