Study on the interaction and evolution of surface dielectric barrier discharge channels

doi:10.1088/1674-1056/adf82b

Abstract The dynamic evolution characteristics of the discharge channel are a key factor influencing the plasma distribution of surface dielectric barrier discharge (SDBD). In this paper, a novel oblique dual-tip SDBD actuator structure is proposed to investigate the multi-stage development mechanism of discharge channels. Experimental results demonstrate that when the oblique angle between the two tips ranges from 30° to 90°, strong mutual repulsion occurs between the discharge channels, with the repulsion intensity increasing as the voltage amplitude increases. When the tip angle is 120°, the dynamic evolution of the discharge channel exhibits three distinct stages. In the initial stage, localized ionization occurs near the leading edge of each tip, forming two independent discharge channels. Then the channels merge and extend along a specific direction, creating a single dominant filament. The current between the two tip electrodes was measured, demonstrating the existence of connected discharge channels. In the final stage, the front of the channel develops multistage bifurcation. The study of the three stages of discharge channel development contributes to exploring the mechanisms of mutual exclusion and fusion between discharge channels. These findings provide a theoretical basis for optimizing the structural design and application of SDBD actuators in related fields.

Keywords: oblique dual-tip surface dielectric barrier discharge multiple discharge channels discharge pattern channel interaction

Received: 17 June 2025
Revised: 23 July 2025
Accepted manuscript online: 06 August 2025

PACS:	51.50.+v	(Electrical properties)
	52.20.-j	(Elementary processes in plasmas)
	52.38.Hb	(Self-focussing, channeling, and filamentation in plasmas)

Fund: This project was supported by the National Natural Science Foundation of China (Grant No. 52377135).

Corresponding Authors: Hui Jiang
E-mail: jianghui@cqu.edu.cn

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Hui Jiang(姜慧), Jinyu Tang(唐金宇), and Yufei Han(韩雨菲) Study on the interaction and evolution of surface dielectric barrier discharge channels 2026 Chin. Phys. B 35 035101

[1] Jiang H, Shao T, Zhang C and Yan Ping 2017 Trans. China Electrotech. Soc. 32 33 (in Chinese)
[2] Ye C Y, Huang B D, Zhang C, Chen G Y and Shao T 2020 Trans. China Electrotech. Soc. 35 190616 (in Chinese)
[3] Li Y H, Wu Y and Liang H 2010 Chin. Sci. Bul. 55 3060
[4] Jiang Y, Peng B F and Liu Z Y 2024 Plasma Sources Sci. Technol. 24 044005
[5] Li D, Nikiforov A and Britun N 2016 J. Phys. D: Appl. Phys. 49 455202
[6] Allabakshi S M, Srikar P and Gangwar R K 2021 Sep. Purif. Technol. 296 121344
[7] Jiang H, Shao T, Zhang C, Sun B and Yan P 2013 IEEE Trans. Dielectr. Electr. Insul. 20 1101
[8] Khomich V Y, Yamshchikov V A, Chernyshev S L, Klimov A I and Bityurin V A 2021 Acta Astronaut. 181 292
[9] Zheng X, Song H, Bian D, Zhang C and Shao T 2021 J. Phys. D: Appl. Phys. 54 375202
[10] Li D, Liu D X, Nie Q Y, Zhang C, Rong M Z and Kong M G 2014 Appl. Phys. Lett. 104 204101
[11] Piferi C, Riccardi C and Schiavo M 2022 Clean Eng. Technol. 8 100486
[12] Moreau E, Bayoda K, Benard N, Vacher J and Viallet J 2020 J. Phys. D: Appl. Phys. 54 075207
[13] Jiang H, Shao T, Zhang C, Sun B and Yan P 2018 IEEE Trans. Plasma Sci. 46 3524
[14] Gan W Y, Zhang C, Che X K and Shao T 2019 Proc. CSEE 39 180972 (in Chinese)
[15] Gao G Q, Peng K S, Dong L and Zhang C 2017 Trans. China Electrotech. Soc. 32 006 (in Chinese)
[16] Bose A K, Maddipatla D and Atashbar M Z 2022 IEEE Trans. Plasma Sci. 50 841
[17] Jiang H, Yang F, Li W H and Zhang C 2021 Proc. CSEE 41 201884 (in Chinese)
[18] Peng B F, Jiang N, Wang F Y and Zhang C 2023 Proc. CSEE 43 221262 (in Chinese)
[19] Tian X M, Tian X H, Che X K and Zhang C 2016 High Volt. Eng. 40 025 (in Chinese)
[20] Chen Q Y, Nie W S, Che X K and Zhang C 2020 High Volt. Eng. 46 20190045 (in Chinese)
[21] Yan H, Benard N, Moreau E 2023 J. Appl. Phys. 133 013301
[22] Zhang Q Z, Zhang L, Yang D Z, Li C and Shao T 2021 Plasma Processes Polym. 18 2000234
[23] Fan Z, Yan H, Liu Y, Zhang C and Shao T 2021 Phys. Plasma 25 053519
[24] Zhang J, Wang Y and Wang D 2018 Phys. Plasma 25 072101
[25] Zheng S, Nie Q, Hou C, Shao T and Zhang C 2019 IEEE Trans. Plasma Sci. 47 4840
[26] Moreau E, Cazour J and Benard N 2018 J. Electrost. 93 146
[27] Li W H, Jiang H and Yang F 2020 Trans. China Electrotech. Soc. 35 190923 (in Chinese)
[28] Zhao Y S, Zhang Y, Chen W J and Shao T 2017 Trans. China Electrotech. Soc. 32 170138 (in Chinese)
[29] Zhu H W, Lan C T, Liu D W and Zhang C 2024 High Vol. Eng. 50 20231343 (in Chinese)
[30] Dan L Y, Huang Z Y, Wang F P and Zhang C 2022 Proc. CSEE 43 213122 (in Chinese)
[31] Lu X P and Ostrikov K K 2016 Appl. Phys. Rev. 5 031102
[32] Chen A L, Gao M, Mo L, Zhang C and Shao T 2022 J. Colloid Interface Sci. 614 138
[33] Lu X, Naidis G V, Laroussi M, Reuter S, Graves D B and Ostrikov K 2014 Phys. Rep. 540 123
[34] Brandenburg R 2017 Plasma Sources Sci. Technol. 26 053001
[35] Xu X J 1996 Gas Discharge Physics, pp. 50 (Shanghai: Fudan University Press) (in Chinese)
[36] Lai Y, Jiang H, Han Y, Zhang C and Shao T 2024 Electronics 13 1294
[37] Jiang H and Shao T 2023 Surface Dielectric Barrier Discharge Driven by Nanosecond Pulses, pp. 20 (Singapore:Springer Nature)
[38] Joshi R P and Thagard S M 2013 Plasma Chem. Plasma Process. 33 1
[39] Jiang H, Lai Y, Gong Z, Zhang C and Shao T 2024 J. Phys. D: Appl. Phys. 57 305202
[40] Liu D and Xia S G 2015 High Vol. Eng. 41 039 (in Chinese)

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