A novel method for sacrificial layer release in MEMS devices fabrication

doi:10.1088/1674-1056/19/7/076802

Abstract During the forming process of the free-standing structure or the functional cavity when releasing the high aspect ratio sacrificial layer, such structures tend to stick to the substrate due to capillary force. This paper describes the application of pull-in length conception as design rules to a novel `dimpled' method in releasing sacrificial layer. Based on the conception of pull-in length in adhering phenomenon, the fabrication and releasing sacrificial layer methods using micro bumps based on the silicon substrate were presented. According to the thermal isolation performances of one kind of micro electromechanical system device thermal shear stress sensor, the sacrificial layers were validated to be successfully released.

Keywords: sacrificial layer adhering pull in length bump

Received: 04 March 2009
Revised: 12 January 2010
Accepted manuscript online:

PACS:	85.85.+j	(Micro- and nano-electromechanical systems (MEMS/NEMS) and devices)
	81.65.Ps	(Polishing, grinding, surface finishing)
	07.10.Cm	(Micromechanical devices and systems)

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Shi Sha-Li (石莎莉), Chen Da-Peng (陈大鹏), Jing Yu-Peng (景玉鹏), Ou Yi (欧毅), Ye Tian-Chun (叶甜春), Xu Qiu-Xia (徐秋霞) A novel method for sacrificial layer release in MEMS devices fabrication 2010 Chin. Phys. B 19 076802

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A novel method for sacrificial layer release in MEMS devices fabrication

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