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Other articles related with "three-dimensional integrated circuits"：
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118401 |
Xiaoxian Liu(刘晓贤), Zhangming Zhu(朱樟明), Yintang Yang(杨银堂), Ruixue Ding(丁瑞雪), Yuejin Li(李跃进) |
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Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits |
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Chin. Phys. B
2016 Vol.25 (11): 118401-118401
[Abstract]
(612)
[HTML 0 KB]
[PDF 318 KB]
(299)
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38402 |
Qian Li-Bo (钱利波), Zhu Zhang-Ming (朱樟明), Xia Yin-Shui (夏银水), Ding Rui-Xue (丁瑞雪), Yang Yin-Tang (杨银堂) |
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Through-silicon-via crosstalk model and optimization design for three-dimensional integrated circuits |
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Chin. Phys. B
2014 Vol.23 (3): 38402-038402
[Abstract]
(603)
[HTML 1 KB]
[PDF 1282 KB]
(664)
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