A terahertz on-chip InP-based power combiner designed using coupled-grounded coplanar waveguide lines

doi:10.1088/1674-1056/ac05af

Abstract This article presents the design and performance of a terahertz on-chip coupled-grounded coplanar waveguide (GCPW) power combiner using a 50 μm-thick InP process. The proposed topology uses two coupled-GCPW lines at the end of the input port to substitute two quarter-wavelength GCPW lines, which is different from the conventional Wilkinson power combiner and can availably minimize the coverage area. According to the results obtained, for the frequency range of 210-250 GHz, the insertion losses for each two-way combiner and four-way combiner were lower than 1.05 dB and 1.35 dB, respectively, and the in-band return losses were better than 11 dB. Moreover, the proposed on-chip GCPW-based combiners achieved a compromise in low-loss, broadband, and small-size, which can find wide applications in terahertz bands, such as power amplifiers and signal distribution networks.

Keywords: coupled-GCPW InP technology terahertz monolithic integrated circuits (TMICs) Wilkinson power combiner

Received: 28 January 2021
Revised: 24 March 2021
Accepted manuscript online: 27 May 2021

PACS:	07.50.-e	(Electrical and electronic instruments and components)
	07.57.Hm	(Infrared, submillimeter wave, microwave, and radiowave sources)
	84.40.Lj	(Microwave integrated electronics)

Fund: Project supported in part by the National Natural Science Foundation of China (Grant No. 61871072).

Corresponding Authors: Yong Zhang
E-mail: yongzhang@uestc.edu.cn

Cite this article:

Huali Zhu(朱华利), Yong Zhang(张勇), Kun Qu(屈坤), Haomiao Wei(魏浩淼), Yukun Li(黎雨坤), Yuehang Xu(徐跃杭), and Ruimin Xu(徐锐敏) A terahertz on-chip InP-based power combiner designed using coupled-grounded coplanar waveguide lines 2021 Chin. Phys. B 30 120701

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A terahertz on-chip InP-based power combiner designed using coupled-grounded coplanar waveguide lines

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