中国物理B ›› 2006, Vol. 15 ›› Issue (4): 833-838.doi: 10.1088/1009-1963/15/4/028

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The role of hydrogen in negative bias temperature instability of pMOSFET

李忠贺, 刘红侠, 郝跃   

  1. Key Laboratory of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices,School of Microelectronics, Xidian University, Xi'an 710071, China
  • 收稿日期:2005-10-06 修回日期:2005-11-07 出版日期:2006-04-20 发布日期:2006-04-20
  • 基金资助:
    Project supported by the National Natural Science Foundation of China (Grant No 60206006), the Hi-Tech Research & Development Program of China (Grant No 2004AA1Z1070) and the Key Project of Chinese Ministry of Education (Grant No 104172).

The role of hydrogen in negative bias temperature instability of pMOSFET

Li Zhong-He (李忠贺), Liu Hong-Xia (刘红侠), Hao Yue (郝跃)   

  1. Key Laboratory of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices,School of Microelectronics, Xidian University, Xi'an 710071, China
  • Received:2005-10-06 Revised:2005-11-07 Online:2006-04-20 Published:2006-04-20
  • Supported by:
    Project supported by the National Natural Science Foundation of China (Grant No 60206006), the Hi-Tech Research & Development Program of China (Grant No 2004AA1Z1070) and the Key Project of Chinese Ministry of Education (Grant No 104172).

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摘要： The NBTI degradation phenomenon and the role of hydrogen during NBT stress are presented in this paper. It is found that PBT stress can recover a fraction of Vth shift induced by NBTI. However, this recovery is unstable. The original degradation reappears soon after reapplication of the NBT stress condition. Hydrogen-related species play a key role during a device's NBT degradation. Experimental results show that the diffusion species are neutral, they repassivate Si dangling bond which is independent of the gate voltage polarity. In addition to the diffusion towards gate oxide, hydrogen diffusion to Si-substrate must be taken into account for it also has important influence on device degradation during NBT stress.

关键词: negative bias temperature instability, device degradation, hydrogen diffusion, interface traps

Abstract: The NBTI degradation phenomenon and the role of hydrogen during NBT stress are presented in this paper. It is found that PBT stress can recover a fraction of Vth shift induced by NBTI. However, this recovery is unstable. The original degradation reappears soon after reapplication of the NBT stress condition. Hydrogen-related species play a key role during a device's NBT degradation. Experimental results show that the diffusion species are neutral, they repassivate Si dangling bond which is independent of the gate voltage polarity. In addition to the diffusion towards gate oxide, hydrogen diffusion to Si-substrate must be taken into account for it also has important influence on device degradation during NBT stress.

Key words: negative bias temperature instability, device degradation, hydrogen diffusion, interface traps

中图分类号:  (Metal-insulator-semiconductor structures (including semiconductor-to-insulator))

  • 73.40.Qv
68.35.Dv (Composition, segregation; defects and impurities) 68.35.Fx (Diffusion; interface formation) 72.20.Jv (Charge carriers: generation, recombination, lifetime, and trapping)