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Chin. Phys. B, 2014, Vol. 23(8): 088113    DOI: 10.1088/1674-1056/23/8/088113
INTERDISCIPLINARY PHYSICS AND RELATED AREAS OF SCIENCE AND TECHNOLOGY Prev   Next  

Modeling for V-O2 reactive sputtering process using a pulsed power supply

Wang Tao (王涛)a, Yu He (于贺)a, Dong Xiang (董翔)a, Jiang Ya-Dong (蒋亚东)a, Chen Chao (陈超)a, Wu Ro-Land (胡锐麟)b
a School of Optoelectronic Information, University of Electronic Science and Technology of China (UESTC), Chengdu 610054, China;
b Center for Plasma Material Interaction, Department of Nuclear, Plasma and Radiological Engineering, University of Illinois at Urbana-Champaign, IL, 61801, USA
Abstract  In this article, we present a time-dependent model that enables us to describe the dynamic behavior of pulsed DC reactive sputtering and predict the film compositions of VOx prepared by this process. In this modeling, the average current J is replaced by a new parameter of Jeff. Meanwhile, the four species states of V, V2O3, VO2, and V2O5 in the vanadium oxide films are taken into consideration. Based on this work, the influences of the oxygen gas supply and the pulsed power parameters including the duty cycle and frequency on film compositions are discussed. The model suggests that the time to reach process equilibrium may vary substantially depending on these parameters. It is also indicated that the compositions of VOx films are quite sensitive to both the reactive gas supply and the duty cycle when the power supply works in pulse mode. The‘steady-state’balance values obtained by these simulations show excellent agreement with the experimental data, which indicates that the experimentally obtained dynamic behavior of the film composition can be explained by this time-dependent modeling for pulsed DC reactive sputtering process. Moreover, the computer simulation results indicate that the curves will essentially yield oscillations around the average value of the film compositions with lower pulse frequency.
Keywords:  time-dependent model      pulsed DC reactive sputtering      film composition      duty cycle  
Received:  01 January 2014      Revised:  13 March 2014      Accepted manuscript online: 
PACS:  81.15.Cd (Deposition by sputtering)  
  81.15.Ef  
Fund: Project partially supported by the National Natural Science Foundation of China (Grant Nos. 61071032, 61377063, and 61235006).
Corresponding Authors:  Wang Tao     E-mail:  wtwh@uestc.edu.cn

Cite this article: 

Wang Tao (王涛), Yu He (于贺), Dong Xiang (董翔), Jiang Ya-Dong (蒋亚东), Chen Chao (陈超), Wu Ro-Land (胡锐麟) Modeling for V-O2 reactive sputtering process using a pulsed power supply 2014 Chin. Phys. B 23 088113

[1] Wei X J, Liang C J, Guang K P, De H, Nie Y X, Zhu S Q, Huang F, Zhang W W and Zheng W 2008 Chin. Phys. B 17 3512
[2] Wei X J and Nie Y X 2002 Chin. Phys. 11 737
[3] Schlag J and Scherber W 2000 Thin Solid Films 366 28
[4] Fieldhouse N, Pursel M S, Horn W M and Bharadwaja N S 2009 J. Phys. D: Appl. Phys. 42 055408
[5] Miyazaki H and Yasui I 2006 J. Phys. D: Appl. Phys. 39 2220
[6] Nihei Y, Sasakawa Y and Okimura K 2008 Thin Solid Films 516 3572
[7] Yi X J, Chen C H, Liu L Q, Wang Y R, Xiong B F, Wang H C and Chen S H 2003 Infrared Phys. Technol. 44 137
[8] Berg S and Nyberg T 2005 Thin Solid Films 476 215
[9] Jonsson B L, Nyberg T and Berg S 2000 J. Vac. Sci. Technol. A 18 503
[10] Depla D, Chen Z Y, Bogaerts A, Ignatova V, Gryse D R and Gijbels R 2004 J. Vac. Sci. Technol. A 22 1524
[11] Depla D, Heirwegh S, Mahieu S, Haemers J and Gryse D R 2007 J. Appl. Phys. 101 013301
[12] Depla D, Heirwegh S, Mahieu S and Gryse D R 2007 J. Phys. D: Appl. Phys. 40 1957
[13] Kubart T, Depla D, Martin M D, Nyberg T and Berg S 2008 Appl. Phys. Lett. 92 221501
[14] Kubart T, Jensen J, Nyberg T, Lijeholm L, Depla D and Berg S 2009 Vacuum 83 1295
[15] Kubart T, Trinh H D, Lijeholm L, Hultman L, Hogberg H, Nyberg T and Berg S 2008 J. Vac. Sci. Technol. A 26 565
[16] Yu H, Jiang Y D, Wang T, Wu Z M, Yu J S and Wei X B 2010 J. Vac. Sci. Technol. A 28 466
[17] Wang T, Jiang Y D, Yu H, Wu Z M and Zhao H N 2011 Chin. Phys. B 20 038101
[18] Kusano E 1993 J. Appl. Phys. 73 8565
[19] Kusano E and Kinbara A 2000 J. Appl. Phys. 87 2015
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