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Chin. Phys. B, 2014, Vol. 23(4): 044601    DOI: 10.1088/1674-1056/23/4/044601
ELECTROMAGNETISM, OPTICS, ACOUSTICS, HEAT TRANSFER, CLASSICAL MECHANICS, AND FLUID DYNAMICS Prev   Next  

Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

Ren Huai-Huia b, Wang Xi-Shub
a Longyuan (Beijing) Wind Power Engineer Technology Co. Ltd, Beijing 100034, China;
b Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
Abstract  This paper studies and compares the effects of pull-pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy (SEM) in-situ technology and nonlinear finite element modeling, respectively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.
Keywords:  solder joint      fatigue life      hysteresis energy      SEM in-situ technology  
Received:  04 June 2013      Revised:  25 August 2013      Published:  15 April 2014
PACS:  46.50.+a (Fracture mechanics, fatigue and cracks)  
  74.25.Jb (Electronic structure (photoemission, etc.))  
  62.20.M- (Structural failure of materials)  
Fund: Project supported by the National Basic Research Program of China (Grant No. 2010CB631006) and the National Natural Science Foundation of China (Grant Nos. 11072124 and 11272173).
Corresponding Authors:  Ren Huai-Hui     E-mail:  renhuaihui@foxmail.com
About author:  46.50.+a; 74.25.Jb; 62.20.M-

Cite this article: 

Ren Huai-Hui, Wang Xi-Shu Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads 2014 Chin. Phys. B 23 044601

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