Chinese Physics B
Mechanism of microweld formation and breakage during Cu-Cu wire bonding investigated by molecular dynamics simulation
Beikang Gu(顾倍康), Shengnan Shen(申胜男), and Hui Li(李辉)
Chin. Phys. B . 2022, (1): 16101 -016101 .  DOI: 10.1088/1674-1056/ac0e24

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