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Thermal diffusivity of light-emitting diode packaging material determined by photoacoustic piezoelectric technique
Sun Qi-Ming(孙启明), Gao Chun-Ming(高椿明), Zhao Bin-Xing(赵斌兴), and Rao Hai-Bo(饶海波)
Chin. Phys. B . 2010, (
11
): 118103 -118104 . DOI: 10.1088/1674-1056/19/11/118103